Datasheet

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MPX2300DT1

Rev 9, 10/2012

Freescale Semiconductor

Data Sheet: Technical Data

Pressure

High Volume Pressure Sensor

for Disposable Applications

Freescale Semiconductor has developed a low cost, high volume, miniature

pressure sensor package which is ideal as a sub-module component or a

disposable unit. The unique concept of the Chip Pak allows great flexibility in

system design while allowing an economic solution for the designer. This new

chip carrier package uses Freescale Semiconductor's unique sensor die with its

piezoresistive technology, along with the added feature of on-chip, thin-film

temperature compensation and calibration.

NOTE:Freescale Semiconductor is also offering the Chip Pak package in

application-specific configurations, which will have an “SPX” prefix,

followed by a four-digit number, unique to the specific customer

Features

• Low Cost

• Integrated Temperature Compensation and Calibration

• Ratiometric to Supply Voltage

• Polysulfone Case Material (ISO 10993)

• Provided in Easy-to-Use Tape and Reel

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).

Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices

during all processes.

Table 1. Pin Numbers

ORDERING INFORMATION

Device Name Package Options

Case

No.

Pressure Type

Device Marking

Gauge Differential Absolute

MPX2300DT1

Tape and Reel 423A

• Date Code, Lot ID

MPX2301DT1

Tape and Reel 423A

• Date Code, Lot ID

Pin Number 1 2 3 4

Description V

GND

MPX2300DT1

Pressure Sensors

0 to 300 mmHg

(0 to 40 kPa)

MPX2301DT1

CHIP PAK PACKAGE

MPX2300DT1/MPX2301DT1

CASE 423A-03

Application Examples

• Medical Diagnostics

• Infusion Pumps

• Blood Pressure Monitors

• Pressure Catheter Applications

• Patient Monitoring

Summary of content (6 pages)

PAGE 1
Pressure MPX2300DT1 Rev 9, 10/2012 Freescale Semiconductor Data Sheet: Technical Data High Volume Pressure Sensor for Disposable Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.
PAGE 2
Pressure The MPX2300DT1/MPX2301DT1 Pressure Sensors have been designed for medical usage by combining the performance of Freescale's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 125 PSI Storage Temperature Tstg -25 to +85 C Operating Temperature TA +15 to +40 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Operating Characteristics Table 3.
PAGE 4
Pressure PACKAGE DIMENSIONS A M C L F N B 1 2 3 4 V K DETAIL A -T- D1 G J H FRONT VIEW E END VIEW AC F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MILLIMETERS MIN MAX MIN MAX 0.240 0.260 6.10 6.60 0.350 0.370 8.89 9.40 0.140 0.150 3.56 3.81 0.012 0.020 0.30 0.51 0.014 0.022 0.36 0.56 0.088 0.102 2.24 2.59 0.123 0.128 3.12 3.25 0.045 0.055 1.14 1.40 0.037 0.
PAGE 5
Pressure Table 4. Revision History Revision number Revision date 9 10/2012 Description of changes • Added Table 1. Pin Numbers on page 1. MPX2300DT1 Sensors Freescale Semiconductor, Inc.
PAGE 6
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