Datasheet

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MPX4250

Rev 7, 1/2009

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPX4250 series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications,

particularly those employing a microcontroller or microprocessor with A/D

inputs. This transducer combines advanced micromachining techniques, thin-

film metallization, and bipolar processing to provide an accurate, high-level

analog output signal that is proportional to the applied pressure. The small

form factor and high reliability of on-chip integration make the Freescale

sensor a logical and economical choice for the automotive system engineer.

Features

• Differential and Gauge Applications Available

• 1.4% Maximum Error Over 0° to 85°C

• Patented Silicon Shear Stress Strain Gauge

• Temperature Compensated Over –40° to +125°C

• Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules

• Durable Epoxy Unibody Element

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX4250 Series)

MPX4250D

Tray 867

• •

MPX4250D

MPX4250GP

Tray 867B

• •

MPX4250GP

MPX4250DP

Tray 867C

• •

MPX4250DP

MPX4250

Series

0 to 250 kPa (0 to 36.3 psi)

0.2 to 4.9 V Output

MPX4250D

CASE 867

UNIBODY PACKAGES

MPX4250DP

CASE 867C

MPX4250GP

CASE 867B

Application Examples

• Ideally Suited for Microprocessor or

Microcontroller-Based Systems

Summary of content (9 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX4250 Rev 7, 1/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX4250 Series 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.9 V Output The MPX4250 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range Supply Voltage Symbol Min Typ Max Unit POP 0 — 250 kPa VS 4.85 5.1 5.35 Vdc Io — 7.0 10 mAdc (0 to 85°C) Voff 0.139 0.204 0.269 Vdc (0 to 85°C) VFSO 4.844 4.909 4.974 Vdc (0 to 85°C) VFSS — 4.705 — Vdc (0 to 85°C) — — — ±1.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 1000 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the differential/gauge pressure sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media.
PAGE 5
Pressure Transfer Function (MPX4250) Nominal Transfer Value: Vout = VS x (0.00369 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.00369 x VS) VS = 5.1 ± 0.25 Vdc Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier –40 0 to 85 +125 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band 5.0 Pressure Error (kPa) 4.0 3.0 2.0 1.0 0 –1.0 –2.
PAGE 6
Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6.
PAGE 7
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G MPX4250 Sensors Freescale Semiconductor 7
PAGE 8
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G MPX4250 8 Sensors Freescale Semiconductor
PAGE 9
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.