Datasheet

MPX4250
Sensors
6 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
123456
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005) T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERSINCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC 2.54 BSC
0.40
18.42
30˚ NOM 30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29 2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
BASIC ELEMENT (D)
CASE 867-08
ISSUE N
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
R
X
123456
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
PORT #2
VACUUM
(P2)
SEATING
PLANE
SEATING
PLANE
-T- -T-
P
G
C
J
N
B
F
D
6 PL
W
V
L
U
S
K
-Q-
-A-
M
Q
M
0.25 (0.010) T
M
A
M
0.13 (0.005)
STYLE 1:
PIN 1. VOUT
2. GROUND
3. V
CC
4. V1
5. V2
6. V
EX
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S
U 0.910 BSC 23.11 BSC
V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38
X 0.248 0.278 6.30 7.06
0.220 0.240 5.59 6.10
PRESSURE AND VACUUM SIDE DUAL PORTED (DP)
CASE 867C-05
ISSUE F