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MPX5050

Rev 11, 03/2010

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXx5050 series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications,

but particularly those employing a microcontroller or microprocessor with A/D

inputs. This patented, single element transducer combines advanced

micromachining techniques, thin-film metallization, and bipolar processing to

provide an accurate, high level analog output signal that is proportional to the

applied pressure.

Features

• 2.5% Maximum Error over 0° to 85°C

• Ideally suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated Over -40° to +125

°C

• Patented Silicon Shear Stress Strain Gauge

• Durable Epoxy Unibody Element

• Easy-to-Use Chip Carrier Option

ORDERING INFORMATION

Device Name

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX5050 Series)

MPX5050D

867 • • MPX5050D

MPX5050DP

867C • • MPX5050DP

MPX5050GP

867B • • MPX5050GP

MPX5050GP1

867B • • MPX5050GP

Small Outline Package (MPXV5050 Series)

MPXV5050GP

1369 • • MPXV5050GP

MPXV5050DP

1351 • • MPXV5050DP

MPXV5050GC6U

482A • • MPXV5050G

MPXV5050GC6T1

482A • • MPXV5050G

Small Outline Package (Media Resistant Gel) (MPVZ5050 Series)

MPVZ5050GW7U

1560 • • MZ5050GW

MPX5050

Series

0 to 50 kPa (0 to 7.25 psi)

0.2 to 4.7 V Output

MPXV5050

MPVZ5050

Summary of content (18 pages)

PAGE 1
Pressure Freescale Semiconductor MPX5050 Rev 11, 03/2010 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5050 MPXV5050 MPVZ5050 Series 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output The MPXx5050 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
Pressure UNIBODY PACKAGES MPX5050D CASE 867-08 MPX5050GP CASE 867B-04 MPX5050DP CASE 857C-05 SMALL OUTLINE PACKAGES MPVZ5050GW7U CASE 1560-03 MPXV5100GC6U CASE 482A-01 MPXV5050DP CASE 1351-01 MPXV5050GP CASE 1369-01 MPX5050 2 Sensors Freescale Semiconductor
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85°C) Voff 0.088 0.2 0.313 Vdc Full Scale Output(4) @ VS = 5.
PAGE 4
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 5
Pressure On-chip Temperature Compensation and Calibration Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media.
PAGE 6
Pressure Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Band 4.0 Temp 3.0 Temperature Error Factor –40 0 to 85 +125 2.0 Multiplier 3 1 3 1.0 0.0 –40 –20 0 20 40 60 Temperature in °C 80 100 120 140 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.
PAGE 7
Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5050 8 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5050 Sensors Freescale Semiconductor 9
PAGE 10
Pressure PACKAGE DIMENSIONS P 0.25 (0.010) M T Q –A– M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N –Q– PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE –T– –T– J S SEATING PLANE D 6 PL G F 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 11
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5050 12 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 13
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5050 14 Sensors Freescale Semiconductor
PAGE 15
Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 15
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 16 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5050 Sensors Freescale Semiconductor 17
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