Datasheet

MPX5050
Sensors
Freescale Semiconductor 5
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 2. Output vs. Pressure Differential
Figure 3. Cross-Sectional Diagram (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Differential Pressure (kPa)
Output (V)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0 5 10 15 20 25 30 35 40 45 5550
Transfer Function:
V
out
= V
S
*(0.018*P+0.04) ± ERROR
V
S
= 5.0 Vdc
TEMP = 0 to 85°C
TYPICAL
MIN
MAX
Fluorosilicone
Gel Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
Die
Bond
Epoxy
Plastic
Case
P2
Differential/Gauge Element
+5 V
1.0 μF
0.01 μF
470 pFGND
V
s
V
out
IPS
OUTPUT