Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 700 kPa Print

MPX5700

Rev 10, 10/2012

Freescale Semiconductor

Data Sheet: Technical Data

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPX5700 series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications,

but particularly those employing a microcontroller or microprocessor with A/D

inputs. This patented, single element transducer combines advanced

micromachining techniques, thin-film metallization, and bipolar processing to

provide an accurate, high level analog output signal that is proportional to the

applied pressure.

Features

• 2.5% Maximum Error over 0 to 85C

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

• Available in Absolute, Differential and Gauge Configurations

• Patented Silicon Shear Stress Strain Gauge

• Durable Epoxy Unibody Element

ORDERING INFORMATION

Device Name

Case

No.

# of Ports Pressure Type

Device

Name

None Single Dual Gauge Differential Absolute

Unibody Package (MPX5700 Series)

MPX5700A

867 • • MPX5700A

MPX5700AP

867B • • MPX5700AP

MPX5700AS

867E • • MPX5700A

MPX5700ASX

867F • • MPX5700A

MPX5700D

867 • • MPX5700D

MPX5700DP

867C • • MPX5700DP

MPX5700GP

867B • • MPX5700GP

MPX5700GP1

(1)

1. MPX5700GP1 has 90 degree lead form.

867B • • MPX5700GP

MPX5700GS

867E • • MPX5700D

MPX5700

Series

0 to 700 kPa (0 to 101.5 psi)

15 to 700 kPa (2.18 to 101.5 psi)

0.2 to 4.7 V Output

MPX5700A/D

CASE 867-08

MPX5700AP/GP/GP1

CASE 867B-04

MPX5700DP

CASE 867C-05

MPX5700AS/GS

CASE 867E-03

MPX5700ASX

CASE 867F-03

UNIBODY PACKAGES

Summary of content (11 pages)

PAGE 1
Pressure MPX5700 Rev 10, 10/2012 Freescale Semiconductor Data Sheet: Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPX5700 Series 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 15 — — 700 700 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current IO — 7.0 10 mAdc Voff 0.088 0.184 0.2 — 0.313 0.409 Vdc (0 to 85C) VFSO 4.587 4.7 4.813 Vdc (0 to 85C) VFSS — 4.5 — Vdc (0 to 85C) — — — 2.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Maximum Pressure(2) Parametrics Symbol (P2  1 Atmosphere) Value Unit P1max 2800 kPa Storage Temperature Tstg -40 to +125 C Operating Temperature TA -40 to +125 C 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 3. illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high-pressure cyclic application, consult the factory.
PAGE 5
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
PAGE 6
Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6.
PAGE 7
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors Freescale Semiconductor, Inc.
PAGE 8
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 8 Sensors Freescale Semiconductor, Inc.
PAGE 9
Pressure PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K 4 3 2 1 S J N 5 G F E D 6 PL -T- 0.13 (0.005) M T B M INCHES MILLIMETERS MIN MAX MIN MAX 0.720 17.53 18.28 0.690 6.22 6.48 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.027 0.033 0.69 0.178 0.186 4.52 4.72 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.
PAGE 10
Pressure Table 3. Revision History Revision number Revision date 10 10/2012 Description of changes • On page 1, added a table note to the Ordering Information table indicating that the device MPX5700GP1 has 90 degree lead form. MPX5700 10 Sensors Freescale Semiconductor, Inc.
PAGE 11
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