Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 20 kPa up to 105 kPa SMD

MPX4100A

Rev 9, 1/2009

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

for Manifold Absolute Pressure

Applications On-Chip Signal

Conditioned, Temperature

Compensated and Calibrated

The MPX4100A series Manifold Absolute Pressure (MAP) sensor for

engine control is designed to sense absolute air pressure within the intake

manifold. This measurement can be used to compute the amount of fuel

required for each cylinder. The small form factor and high reliability of on-chip

integration makes the MAP sensor a logical and economical choice for

automotive system designers.

The MPX4100A series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output

signal that is proportional to applied pressure.

Features

• 1.8% Maximum Error Over 0° to 85°C

• Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems

• Ideally Suited for Microprocessor Interfacing or Microcontroller Based Systems

• Temperature Compensated Over -40°C to +125°C

• Durable Epoxy Unibody Element

• Ideal for Non-Automotive Applications

• Available as Standard Fluorosilicone Gel (MPXA4100A, MPX4100A) or Media Resistant Gel (MPXAZ4100A)

• Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX4100A Series)

MPX4100A

Trays 867-08

• •

MPX4100A

MPX4100AP

Trays 867B-04

• •

MPX4100AP

MPX4100AS

Trays 867E-03

• •

MPX4100AS

Small Outline Package (MPXAZ4100A Series) (Media Resistant Gel)

MPXAZ4100A6U

Rails 482

• •

MPXAZ4100A

MPXAZ4100AC6U

Rails 482A

• •

MPXAZ4100A

Small Outline Package (MPXA4100A Series)

MPXA4100A6T1

Tape and Reel 482

• •

MPXA4100A

MPXA4100AC6U

Rails 482A

• •

MPXA4100A

MPXA4100A6U

Rails 482

• •

MPXA4100A

MPX4100A

20 to 105 kPa (2.9 to 15.2 psi)

0.3 to 4.9 V Output

Series

Application Examples

• Manifold Sensing for Automotive

Systems

• Also Ideal for Non-Automotive

Applications

Summary of content (13 pages)

PAGE 1
Pressure Freescale Semiconductor + MPX4100A Rev 9, 1/2009 Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX4100A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder.
PAGE 2
Pressure UNIBODY PACKAGES MPX4100A CASE 867-08 MPX4100AP CASE 867B-04 MPX4100AS CASE 867E-03 SMALL OUTLINE PACKAGES MPXAZ4100A6U MPXA4100A6U/T1 CASE 482-01 MPXAZ4100AC6U MPXA4100AC6U CASE 482A-01 MPX4100A 2 Sensors Freescale Semiconductor
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 20 — 105 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Pressure Range (1) Minimum Pressure Offset @ VS = 5.1 Volts(3) (0 to 85°C) Voff 0.225 0.306 0.388 Vdc Full Scale Output @ VS = 5.
PAGE 4
Pressure Maximum Ratings Table 2. MAXIMUM RATINGS(1) Rating Symbol Value Unit PMAX 400 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 5
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4100A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media.
PAGE 6
Pressure Transfer Function (MPX4100A) Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518) ± (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4100A Series 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure 3.
PAGE 7
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel, which protects the die from harsh media. The MPX pressure Part Number sensor is designed to operate with positive differential pressure applied, P1 > P2.
PAGE 8
Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.
PAGE 9
Pressure PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6.
PAGE 10
Pressure PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K J N 5 -T- 3 2 1 S G F E 4 D 6 PL 0.13 (0.005) M T B M INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.027 0.033 0.69 0.84 0.178 0.186 4.52 4.72 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.
PAGE 11
Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4100A Sensors Freescale Semiconductor 11
PAGE 12
Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PORTED (AP) MPX4100A 12 Sensors Freescale Semiconductor
PAGE 13
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