Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 15 kPa up to 115 kPa SMD

Document Number: MPXA6115A

Rev 7.2, 10/2012

Freescale Semiconductor

Data Sheet: Technical Data

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXxx6115A series sensor integrates on-chip, bipolar op amp

circuitry and thin film resistor networks to provide a high output signal and

temperature compensation. The small form factor and high reliability of on-

chip integration make the pressure sensor a logical and economical choice

for the system designer.

The MPXxx6115A series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output

signal that is proportional to applied pressure.

Features

• Resistant to High Humidity and Common Automotive Media

• Improved Accuracy at High Temperature

• Available in Small and Super Small Outline Packages

• 1.5% Maximum Error over 0 to 85C

• Ideally suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated from -40 to +125C

• Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name

Package

Option

Case No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXA6115A Series)

MPXA6115A6U Rails 482 • • MPXA6115A

MPXA6115A6T1 Tape and Reel 482 • • MPXA6115A

MPXA6115AC6U Rails 482A • • MPXA6115A

MPXA6115AC6T1 Tape and Reel 482A • • MPXA6115A

MPXA6115AC7U Rails 482C • • MPXA6115A

Small Outline Package (Media Resistant Gel) (MPXAZ6115A Series)

MPXAZ6115A6U Rails 482 • • MPXAZ6115A

MPXAZ6115AC6U Rails 482A • • MPXAZ6115A

MPXAZ6115AC6T1 Tape and Reel 482A • • MPXAZ6115A

MPXAZ6115AP Trays 1369 • • MPXAZ6115A

MPXAZ6115APT1 Tape and Reel 1369 • • MPXAZ6115A

Super Small Outline Package (MPXH6115A Series)

MPXH6115A6U Rails 1317 • • MPXH6115A

MPXH6115A6T1 Tape and Reel 1317 • • MPXH6115A

MPXH6115AC6U Rails 1317A • • MPXH6115A

MPXH6115AC6T1 Tape and Reel 1317A • • MPXH6115A

MPXA6115A

Series

MPXH6115A

MPXHZ6115A

15 to 115 kPa (2.2 to 16.7 psi)

0.2 to 4.7 V Output

MPXAZ6115A

Application Examples

• Aviation Altimeters

• Industrial Controls

• Engine Control/Manifold Absolute

Pressure (MAP)

• Weather Station and Weather

Reporting Device Barometers

Summary of content (17 pages)

PAGE 1
Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev 7.2, 10/2012 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXxx6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation.
PAGE 2
ORDERING INFORMATION Small Outline Package (Media Resistant Gel) (MPXHZ6115A Series) MPXHZ6115A6U MPXHZ6115A6T1 MPXHZ6115AC6U MPXHZ6115AC6T1 Rails Tape and Reel Rails Tape and Reel 1317 1317 1317A 1317A • • • • • • • • MPXHZ6115A MPXHZ6115A MPXHZ6115A MPXHZ6115A SMALL OUTLINE PACKAGES MPXA6115A6U/T1 MPXAZ6115A6U CASE 482 MPXA6115AC6U/T1 MPXAZ6115AC6U/T1 CASE 482A MPXA6115AC7U CASE 482C MPXAZ6115AP/T1 CASE 1369 SUPER SMALL OUTLINE PACKAGES MPXH6115A6U/T1 MPXHZ6115A6U/T1 CASE 1317 MPXH6115AC6U/T
PAGE 3
Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Voff 0.133 0.200 0.268 Vdc Full Scale Output(3)(0 to 85C) @ VS = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4)(0 to 85C) @ VS = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc — — — 1.
PAGE 4
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317).
PAGE 5
.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: Vout = Vs* (.009*P-.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85ºC MAX TYP 3.0 2.5 2.0 1.5 MIN 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output vs. Absolute Pressure Transfer Function (MPXxx6115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.
PAGE 6
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process.
PAGE 7
PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.
PAGE 8
PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 4 5 N –B– G 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C –T– INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.
PAGE 9
PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc.
PAGE 10
PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXA6115A 10 Sensors Freescale Semiconductor, Inc.
PAGE 11
PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc.
PAGE 12
PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A 12 Sensors Freescale Semiconductor, Inc.
PAGE 13
PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc.
PAGE 14
PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXA6115A 14 Sensors Freescale Semiconductor, Inc.
PAGE 15
PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc.
PAGE 16
Table 3. Revision History Revision number Revision date 7.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H, 7.2 10/2012 • On page 1, changed typical output voltage from 4.8V to 4.7V to match typical output voltage listed on page 3 of document Description of changes MPXA6115A 16 Sensors Freescale Semiconductor, Inc.
PAGE 17
How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein.