Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 20 kPa up to 304 kPa SMD

Table Of Contents

Document Number: MPXH6300A

Rev 5.1, 05/2012

Pressure

Freescale Semiconductor

Data Sheet: Technical Data

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

The Freescale MPXH6300A series sensor integrates on-chip, bipolar op

amp circuitry and thin film resistor networks to provide a high output signal

and temperature compensation. The small form factor and high reliability of

on-chip integration make the Freescale pressure sensor a logical and

economical choice for the system designer.

The MPXH6300A series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output

signal that is proportional to applied pressure.

Features

• Improved Accuracy at High Temperature

• Available in Super Small Outline Packages

• 1.5% Maximum Error over 0° to 85°C

• Ideally suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated from –40° to +125°C

• Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Super Small Outline Package (MPXH6300A Series)

MPXH6300A6U

Rail 1317

• •

MPXH6300A

MPXH6300A6T1

Tape & Reel 1317

• •

MPXH6300A

MPXH6300AC6U

Rail 1317A

• •

MPXH6300A

MPXH6300AC6T1

Tape & Reel 1317A

• •

MPXH6300A

20 to 304 kPa (3.0 to 42 psi)

0.3 to 4.9 V Output

Series

MPXH6300A6U/6T1

CASE 1317

MPXH6300AC6U/6T1

CASE 1317A

SUPER SMALL OUTLINE PACKAGES

Application Examples

• Industrial Controls

• Engine Control/Manifold Absolute

Pressure (MAP)

Summary of content (13 pages)

PAGE 1
Pressure Freescale Semiconductor Document Number: MPXH6300A Rev 5.1, 05/2012 Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXH6300A Series 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 304 kPa Supply Voltage(1) VS 4.74 5.1 5.46 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset @ VS = 5.1 Volts(2) (0 to 85°C) Voff 0.241 0.306 0.371 Vdc Full Scale Output @ VS = 5.1 Volts(3) (0 to 85°C) VFSO 4.847 4.912 4.977 Vdc Full Scale Span @ VS = 5.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 1200 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C Output Source Current @ Full Scale Output(2) I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 illustrates a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range.
PAGE 5
Pressure Transfer Function (MPXH6300A) Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353) ± (Pressure Error x Temp Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Temperature Error Band MPXH6300A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C.
PAGE 6
Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process.
PAGE 7
Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc.
PAGE 8
Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A 8 Sensors Freescale Semiconductor, Inc.
PAGE 9
Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc.
PAGE 10
Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6300A 10 Sensors Freescale Semiconductor, Inc.
PAGE 11
Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc.
PAGE 12
Pressure Table 3. Revision History Revision number Revision date 5.1 05/2012 Description of changes • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. MPXH6300A 12 Sensors Freescale Semiconductor, Inc.
PAGE 13
How to Reach Us: Information in this document is provided solely to enable system and software Home Page: www.freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: http://www.freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein.