Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 200 kPa SMD

Document Number: MPX2202

Rev 8, 10/2012

Freescale Semiconductor

Data Sheet: Technical Data

Pressure

200 kPa On-Chip Temperature

Compensated Silicon

Pressure Sensors

The MPX2202 devices series are silicon piezoresistive pressure sensor

providing a highly accurate and linear voltage output directly proportional to

the applied pressure. The sensor is a single monolithic silicon diaphragm with

the strain gauge and a thin-film resistor network integrated on chip. The chip

is laser trimmed for precise span and offset calibration and temperature

compensation. They are designed for use in applications such as pump/

motor controllers, robotics, level indicators, medical diagnostics, pressure

switching, barometers, altimeters, etc.

Features

• Temperature Compensated Over 0C to +85C

• Easy-to-Use Chip Carrier Package Options

• Available in Absolute, Differential and Gauge Configurations

• Ratiometric to Supply Voltage

• Available in Easy-to-Use Tape and Reel

ORDERING INFORMATION

Device Name

Case

No.

# of Ports Pressure Type

Device Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX2202 Series)

MPX2202A

344

• •

MPX2202A

MPX2202DP

344C

• •

MPX2202DP

MPX2202AP

344B

• •

MPX2202AP

MPX2202GP

344B

• •

MPX2202GP

MPX2202ASX

344F

• •

MPX2202A

Small Outline Package (MPXV2202 Series)

MPXV2202GP

1369

• •

MPXV2202GP

MPXV2202DP

1351

• •

MPXV2202DP

MPXV2202GC6TI

482A

• •

MPXV2202G

MPAK Package (MPXM2202 Series)

MPXM2202D

1320

• •

MPXM2202D

MPXM2202DT1

1320

• •

MPXM2202D

MPXM2202A

1320

• •

MPXM2202A

MPXM2202GS

1320A

• •

MPXM2202GS

MPXM2202GST1

1320A

• •

MPXM2202GS

MPXM2202AS

1320A

• •

MPXM2202AS

MPX2202

Series

0 to 200 kPa (0 to 29 psi)

40 mV Full Scale

(Typical)

Application Examples

• Pump/Motor Controllers

• Robotics

• Level Indicators

• Medical Diagnostics

• Pressure Switching

• Barometers

• Altimeters

Summary of content (19 pages)

PAGE 1
Pressure Document Number: MPX2202 Rev 8, 10/2012 Freescale Semiconductor Data Sheet: Technical Data 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors MPX2202 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale (Typical) The MPX2202 devices series are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure.
PAGE 2
Pressure UNIBODY PACKAGES MPX2202A CASE 344-15 MPX2202AP/GP CASE 344B-01 MPX2202DP CASE 344C-01 MPX2202ASX CASE 344F-01 MPAK SMALL OUTLINE PACKAGES MPXV2202DP CASE 1351-01 MPXV2202GP CASE 1369-01 MPXV2202GC6T1 CASE 482A-01 MPXM2202A CASE 1320-02 MPXM2202GS/AS CASE 1320A-02 MPX2202 2 Sensors Freescale Semiconductor, Inc.
PAGE 3
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit POP POP 20 0 — — 200 200 kPa kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 38.5 40 41.5 mV Voff -1.0 -2.0 — — 1.0 2.0 mV V/P — 0.2 — mV/kPa — -0.6 -1.0 — — 0.4 1.0 %VFSS Pressure Hysteresis(5) (0 to 200 kPa) — —  0.
PAGE 4
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Max Value Unit 400 kPa Storage Temperature -40 to 125 C Operating Temperature -40 to 125 C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum.
PAGE 5
Pressure On-Chip Temperature Compensation and Calibration VS = 10 VDC TA = 25C P1 > P2 40 35 30 TYP Span Range (TYP) Output (mVDC) 25 MAX 20 15 MIN 10 5 0 kPa PSI -5 0 25 50 7.25 75 100 125 14.5 Pressure 150 21.75 175 Offset (TYP) 200 29 Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2202 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line.
PAGE 6
Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3.
PAGE 7
Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.
PAGE 8
Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3.
PAGE 9
Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 N DIM A B C D F G H J K L N P Q R S U V W PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- 0.25 (0.010) -T- M T Q S S F J G D 4 PL C 0.13 (0.005) T S M S Q S INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.
PAGE 10
Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2 MPX2202 10 Sensors Freescale Semiconductor, Inc.
PAGE 11
Pressure PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc.
PAGE 12
Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 12 Sensors Freescale Semiconductor, Inc.
PAGE 13
Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc.
PAGE 14
Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 14 Sensors Freescale Semiconductor, Inc.
PAGE 15
Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 Sensors Freescale Semiconductor, Inc.
PAGE 16
Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2202 16 Sensors Freescale Semiconductor, Inc.
PAGE 17
Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK MPX2202 Sensors Freescale Semiconductor, Inc.
PAGE 18
Pressure REVISION HISTORY Revision number Revision date 7 01/2012 • In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D devices 8 10/2012 • Deleted references to device number MPXV2022GC6U throughout the document Description of changes MPX2202 Sensors Freescale Semiconductor, Inc.
PAGE 19
How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright Home Page: freescale.com Web Support: freescale.com/support licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein.