Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor 0 kPa up to 3.92 kPa SMD

MPXV5004G

Rev 12, 09/2009

Freescale Semiconductor

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPxx5004 series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications,

but particularly those employing a microcontroller or microprocessor with A/D

inputs. This sensor combines a highly sensitive implanted strain gauge with

advanced micromachining techniques, thin-film metallization, and bipolar

processing to provide an accurate, high level analog output signal that is

proportional to the applied pressure.

Features

• 1.5% Maximum Error for 0 to 100 mm H

O over +10° to +60°C with Auto Zero

• 2.5% Maximum Error for 100 to 400 mm H

O over +10° to +60°C with Auto Zero

• 6.25% Maximum Error for 0 to 400 mm H

O over +10° to +60°C without Auto Zero

• Temperature Compensated over 10° to 60°C

• Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations

• Durable Thermoplastic (PPS) Package

ORDERING INFORMATION

Device Name

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXV5004 Series)

MPXV5004DP 1351 • • MPXV5004DP

MPXV5004GC6T1 482A • • MPXV5004G

MPXV5004GC6U 482A • • MPXV5004G

MPXV5004GC7U 482C • • MPXV5004G

MPXV5004GP 1369 • • MPXV5004GP

MPXV5004GPT1 1369 • • MPXV5004GP

MPXV5004GVP 1368 • • MPXV5004GVP

Small Outline Package (Media Resistant Gel) (MPVZ5004 Series)

MPVZ5004G6T1 482 • • MPVZ5004G

MPVZ5004G6U 482 • • MPVZ5004G

MPVZ5004G7U 482B • • MPVZ5004G

MPVZ5004GC6U 482A • • MPVZ5004G

MPVZ5004GW6U 1735 • • MZ5004GW

MPVZ5004GW7U 1560 • • MZ5004GW

MPXV5004

Series

0 to 3.92 kPa

(0 to 400 mm H

1.0 to 4.9 V Output

MPVZ5004

Application Examples

• Washing Machine Water Level

• Ideally Suited for Microprocessor or

Microcontroller-Based Systems

• Appliance Liquid Level and Pressure

Measurement

• Respiratory Equipment

Summary of content (22 pages)

PAGE 1
Pressure Freescale Semiconductor MPXV5004G Rev 12, 09/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV5004 MPVZ5004 Series 0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V Output The MPxx5004 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
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Pressure SMALL OUTLINE PACKAGES THROUGH-HOLE MPVZ5004G7U CASE 482B-03 MPXV5004GC7U CASE 482C-03 MPVZ5004GW7U CASE 1560-02 SMALL OUTLINE PACKAGES SURFACE MOUNT MPVZ5004G6U/6T1 CASE 482-01 MPXV5004DP CASE 1351-01 MPVZ5004GW6U CASE 1735-01 MPXV5004G6U/6T1, MPVZ5004GC6U CASE 482A-01 MPXV5004GVP CASE 1368-01 MPXV5004GP/GPT1 CASE 1369-01 MPXV5004G 2 Sensors Freescale Semiconductor
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Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 VDC IS — — 10 mAdc Span @ 306 mm H2O (3 Full Scale Span @ 400 mm H2O (3.92 kPa)(2) VFSS — — 3.0 4.0 — — V Offset(3) VOFF 0.75 1.0 1.25 V V/P — 1.0 — V/kPa 0 to 100 mm H2O (10 to 60°C) — — — ±1.
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Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 5
Pressure +5 V OUTPUT Vout Vs IPS 1.0 μF GND 0.01 μF 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to AN1646.) 5.0 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 6.25% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.0 4.0 3.0 MAX Output (V) Output (V) 3.0 TYPICAL 2.0 MIN 1.0 0 0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C TYPICAL 2.0 MIN 1.0 2.0 1.0 MAX 3.0 0 4.
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Pressure INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process.
PAGE 7
Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.
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Pressure PACKAGE DIMENSIONS –A– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 –B– G 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C –T– SEATING PLANE DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 9
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G 10 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 11
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G 12 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MPXV5004G Sensors Freescale Semiconductor 13
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G 14 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 15
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 1560-03 ISSUE C SMALL OUTLINE PACKAGE MPXV5004G 16 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 17
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Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPXV5004G 18 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 19
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Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G 20 Sensors Freescale Semiconductor
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Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPXV5004G Sensors Freescale Semiconductor 21
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