Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor -115 kPa up to 0 kPa SMD

Document Number: MPXV6115V

Rev 3, 1/2013

Freescale Semiconductor

Data Sheet: Technical Information

Pressure

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

The MPXV6115V series sensor integrates on-chip, bipolar op amp circuitry

and thin film resistor networks to provide a high output signal and temperature

compensation. The small form factor and high reliability of on-chip integration

make the Freescale Semiconductor, Inc. pressure sensor a logical and

economical choice for the system designer.

The MPXV6115V series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output

signal that is proportional to applied pressure.

Features

• Improved Accuracy at High Temperature

• 1.5% Maximum Error from 0 to 85C

• Ideally suited for Microprocessor- or Microcontroller-Based Systems

• Temperature Compensated from –40 to +125C

• Durable Thermoplastic (PPS) Surface Mount Package

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package (MPXV6115VC6U Series)

MPXV6115V6U Rail 482 •

Vacuum/

Gauge

MPXV6115V

MPXV6115V6T1 Tape and Reel 482 •

Vacuum/

Gauge

MPXV6115V

MPXV6115VC6U Rail 482A •

Vacuum/

Gauge

MPXV6115V

MPXV6115VC6T1 Tape and Reel 482A •

Vacuum/

Gauge

MPXV6115V

SMALL OUTLINE PACKAGE

MPXV6115VC6U/T1

CASE 482A

MPXV6115V6U/T1

CASE 482

Application Examples

• Vacuum Pump Monitoring

• Brake Booster Monitoring

MPXV6115V

Series

–115 to 0 kPa (–16.7 to 0 psi)

0.2 to 4.6 V Output

Summary of content (9 pages)

PAGE 1
Pressure Freescale Semiconductor Document Number: MPXV6115V Rev 3, 1/2013 Data Sheet: Technical Information High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV6115V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP –115 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Full Scale Output(2) @ VS = 5.0 Volts (0 to 85C) VFSO 4.534 4.6 4.665 Vdc Full Scale Span(3) @ VS = 5.0 Volts (0 to 85C) VFSS — 4.4 — Vdc Accuracy(4) (0 to 85C) — — — 1.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 C Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) TA –40 to +125 C I o+ 0.5 mAdc Io – –0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 482A). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range.
PAGE 5
Pressure Transfer Function (MPXV6115VC6U) Nominal Transfer Value: Vout = VS x (0.007652 x P + 0.92) ± (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXV6115V 4.0 3.0 Temp. Multiplier –40 0 to 85 125 3 1 2 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 1.950 Pressure Error (kPa) 1.
PAGE 6
Pressure Surface Mounting Information MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process.
PAGE 7
Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S –B– G 8 1 S N H C J –T– PIN 1 IDENTIFIER M K SEATING PLANE DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.
PAGE 8
Pressure Table 3. Revision number Revision date 2 10/2012 • Added devices MPXB611V6U and MPX6115V6T1 and corresponding package, 482.
PAGE 9
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