Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor -7 kPa up to 7 kPa SMD

MPXV7007

Rev 3, 10/2012

Freescale Semiconductor

Data Sheet: Technical Data

Pressure

Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXV7007 series piezoresistive transducers are state-of-the-art

monolithic silicon pressure sensors designed for a wide range of applications,

but particularly those employing a microcontroller or microprocessor with A/D

inputs. This transducer combines advanced micromachining techniques, thin-

film metallization, and bipolar processing to provide an accurate, high level

analog output signal that is proportional to the applied pressure.

Features

• 5.0% Maximum Error Over 0 to 85C

• Ideally Suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated Over –40 to +125C

• Thermoplastic (PPS) Surface Mount Package

• Patented Silicon Shear Stress Strain Gauge

• Available in Differential and Gauge Configurations

ORDERING INFORMATION

Device Name

Package

Options

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package

MPXV

7007

Trays

1351

• •

MPXV

7007

MPXV7007DPT1

Tape & Reel

1351

• •

MPXV

7007

MPXV7007GC6U

Rails

482A

• •

MPXV

7007

MPXV

7007

GC6T1

Tape & Reel

482A

• •

MPXV

7007

MPXV

7007

Trays

1369

• •

MPXV

7007

Table 1. Pin Numbers

(1)

1.Pins 1, 5, 6, 7 and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.

1 2 3 4 5 6 7 8

N/C V

Gnd V

out

N/C N/C N/C N/C

MPXV7007

Series

-7 to 7 kPa (-1 to 1 psi)

0.5 to 4.5 V Output

SMALL OUTLINE PACKAGE

MPXV7007GC6U/C6T1

CASE 482A-01

MPXV7007DP/DPT1

CASE 1351-01

MPXV7007GP

CASE 1369-01

Application Examples

• Hospital Beds

•HVAC

• Respiratory Systems

• Process Control

Summary of content (11 pages)

PAGE 1
Pressure MPXV7007 Rev 3, 10/2012 Freescale Semiconductor Data Sheet: Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7007 Series -7 to 7 kPa (-1 to 1 psi) 0.5 to 4.5 V Output The MPXV7007 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs.
PAGE 2
Pressure Operating Characteristics Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP -7 — 7 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85C) Voff 0.33 0.5 0.67 Vdc Full Scale Output(4) @ VS = 5.0 Volts (0 to 85C) VFSO 4.3 4.5 4.
PAGE 3
Pressure Maximum Ratings Table 3. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure Pmax 75 kPa Storage Temperature Tstg –40 to +125 C Operating Temperature TA –40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482).
PAGE 5
Pressure 5.0 Transfer Function: Vout = VS*(0.057*P+0.5) ± ERROR VS = 5.0 Vdc TEMP = 0º to 85ºC 4.5 4.0 3.5 Output (V) 3.0 2.5 TYPICAL MAX 2.0 MIN 1.5 1.0 0.5 0 -7 0 7 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential Transfer Function Nominal Transfer Value: Vout = VS x (0.057 x P + 0.5) ± (Pressure Error x Temp. Factor x 0.057 x VS) VS = 5.0 V  0.25 Vdc Temperature Error Band MPXV7007 SERIES 4.0 Temp 3.0 Temperature Error Factor 2.
PAGE 6
Pressure Pressure Error Band 0.5 0.4 0.3 Pressure Error (kPa) 0.2 0.1 0 –0.1 Pressure (kPa) -7 +7 0 –0.2 –0.3 –0.4 –0.5 Pressure - 7 to 7 (kPa) Error (Max) ±0.5 (kPa) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media.
PAGE 7
Pressure PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.
PAGE 8
Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 θ .014 (0.35) L D A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M C A B E1 B N GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C ∅T M A P STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 8X 0.004 (0.1) K DETAIL G C SEATING PLANE NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3.
PAGE 9
Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
PAGE 10
Pressure Table 4. Revision History Revision number Revision date 3 10/2012 Description of changes • Deleted references to device numbers MPXV7007G6T1/U, MPXV7007G6U/T1 and MPXV7007GPT1 throughout the document, deleted Case 482-01 Issue O Small Outline Package diagram on page 7 MPXV7007 10 Sensors Freescale Semiconductor, Inc.
PAGE 11
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