Datasheet

NXP Semiconductors
NVT2001; NVT2002
Bidirectional voltage level translator
© NXP B.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 27 January 2014
Document identifier: NVT2001_NVT2002
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.1.1 1-bit in XSON6 package . . . . . . . . . . . . . . . . . . 3
5.1.2 2-bit in TSSOP8 and XSON8U packages. . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 4
6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application design-in information . . . . . . . . . . 5
7.1 Enable and disable . . . . . . . . . . . . . . . . . . . . . . 5
7.2 Bidirectional translation . . . . . . . . . . . . . . . . . . 7
7.3 How to size pull-up resistor value. . . . . . . . . . . 7
7.4 How to design for maximum frequency
operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
9 Recommended operating conditions. . . . . . . 11
10 Static characteristics. . . . . . . . . . . . . . . . . . . . 11
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 13
11.1 Open-drain drivers . . . . . . . . . . . . . . . . . . . . . 13
12 Performance curves . . . . . . . . . . . . . . . . . . . . 14
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Soldering of SMD packages . . . . . . . . . . . . . . 18
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 18
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 18
14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 18
14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 19
15 Soldering: PCB footprints. . . . . . . . . . . . . . . . 20
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19 Contact information. . . . . . . . . . . . . . . . . . . . . 25
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26