Datasheet

NXP Semiconductors
NX3020NAKS
30 V, 180 mA dual N-channel Trench MOSFET
NX3020NAKS All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 11 November 2013 11 / 15
13. Soldering
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35
0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
Fig. 19. Reflow soldering footprint for TSSOP6 (SOT363)
sot363_fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
Fig. 20. Wave soldering footprint for TSSOP6 (SOT363)