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1. Product proﬁle

1.1 General description

PNP low V

CEsat

Breakthrough In Small Signal (BISS) transistor and NPN Resistor-

Equipped Transistor (RET) in a SOT457 (SC-74) small Surface-Mounted Device (SMD)

plastic package.

1.2 Features

n Low V

CEsat

(BISS) and resistor-equipped transistor in one package

n Low threshold voltage (< 1 V) compared to MOSFET

n Low drive power required

n Space-saving solution

n Reduction of component count

1.3 Applications

n Supply line switches

n Battery charger switches

n High-side switches for LEDs, drivers and backlights

n Portable equipment

1.4 Quick reference data

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al

, standard footprint.

[2] Pulse test: t

≤ 300 µs; δ≤0.02.

PBLS4005D

40 V PNP BISS loadswitch

Rev. 03 — 6 January 2009 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

TR1; PNP low V

CEsat

transistor

CEO

collector-emitter voltage open base - - −40 V

collector current

[1]

--−1A

CEsat

collector-emitter saturation

resistance

= −500 mA;

= −50 mA

[2]

- 240 340 mΩ

TR2; NPN resistor-equipped transistor

CEO

collector-emitter voltage open base - - 50 V

output current - - 100 mA

R1 bias resistor 1 (input) 33 47 61 kΩ

R2/R1 bias resistor ratio 0.8 1 1.2

Summary of content (15 pages)

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PBLS4005D 40 V PNP BISS loadswitch Rev. 03 — 6 January 2009 Product data sheet 1. Product profile 1.1 General description PNP low VCEsat Breakthrough In Small Signal (BISS) transistor and NPN ResistorEquipped Transistor (RET) in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package. 1.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 emitter TR1 2 base TR1 3 output (collector) TR2 4 GND (emitter) TR2 5 input (base) TR2 6 collector TR1 6 5 4 1 2 3 Graphic symbol 6 5 R1 4 R2 TR2 TR1 1 2 3 sym036 3. Ordering information Table 3. Ordering information Type number PBLS4005D Package Name Description Version SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 4.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa461 0.8 Ptot (W) (1) 0.6 (2) (3) 0.4 0.2 0 0 40 80 120 160 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa462 103 δ=1 0.75 0.5 0.33 102 0.2 0.1 Zth(j-a) (K/W) 0.05 0.02 0.01 10 0 1 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aaa463 103 Zth(j-a) (K/W) δ=1 0.75 0.5 0.33 0.2 102 0.1 0.05 10 0.02 0.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa464 103 Zth(j-a) (K/W) δ = 1 0.75 0.5 2 10 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 102 10 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 4. TR1 (PNP): Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch Table 7. Characteristics …continued Tamb = 25 °C unless otherwise specified.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa465 1200 hFE 800 −2.4 006aaa469 IC (A) IB (mA) = −24 −21.6 −19.2 −16.8 −14.4 −12 −9.6 −1.6 (1) −7.2 (2) −4.8 −0.8 400 −2.4 (3) 0 −10−1 −1 −10 −102 0 −103 −104 IC (mA) 0 VCE = −5 V −1 −2 −3 −4 −5 VCE (V) Tamb = 25 °C (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 5. TR1 (PNP): DC current gain as a function of collector current; typical values 006aaa467 −1.0 VBE (V) Fig 6.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa466 −1 006aaa471 −10 VCEsat (V) VCEsat (V) −1 −10−1 −10−1 (1) (2) (1) (2) −10−2 −10−1 −10−2 (3) −1 −10 −102 −103 −104 IC (mA) (3) −10−3 −10−1 −1 −102 −103 −104 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 9.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 006aaa042 103 hFE (1) (2) (3) 006aaa043 10−1 (1) VCEsat (V) (2) (3) 102 10 1 10−1 1 102 10 10−2 1 IC (mA) VCE = 5 V IC/IB = 20 (1) Tamb = 150 °C (1) Tamb = 100 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = −40 °C (3) Tamb = −40 °C Fig 13. TR2 (NPN): DC current gain as a function of collector current; typical values 006aaa044 10 102 10 IC (mA) Fig 14.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 8. Package outline 3.1 2.7 6 3.0 2.5 1.7 1.3 1.1 0.9 5 4 2 3 0.6 0.2 pin 1 index 1 0.40 0.25 0.95 0.26 0.10 1.9 Dimensions in mm 04-11-08 Fig 17. Package outline SOT457 (SC-74) 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 10. Soldering 3.45 1.95 0.45 0.55 (6×) (6×) 0.95 solder lands solder resist 3.3 2.825 0.95 solder paste occupied area 0.7 (6×) Dimensions in mm 0.8 (6×) 2.4 sot457_fr Fig 18. Reflow soldering footprint SOT457 (SC-74) 5.3 1.5 (4×) solder lands 1.475 0.45 (2×) 5.05 solder resist occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw Fig 19.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 11. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PBLS4005D_3 20090106 Product data sheet - PBLS4005D_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • Legal texts have been adapted to the new company name where appropriate.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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PBLS4005D NXP Semiconductors 40 V PNP BISS loadswitch 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . .