DISCRETE SEMICONDUCTORS DATA SHEET age M3D088 PBSS5220T 20 V, 2 A PNP low VCEsat (BISS) transistor Product data sheet 2003 Dec 18
NXP Semiconductors Product data sheet 20 V, 2 A PNP low VCEsat (BISS) transistor PBSS5220T FEATURES QUICK REFERENCE DATA • Low collector-emitter saturation voltage VCEsat SYMBOL • High collector current capability: IC and ICM VCEO collector-emitter voltage −20 V IC collector current (DC) −2 A • Reduced printed-circuit board requirements ICM peak collector current −3 A • Cost effective alternative to MOSFETs in specific applications.
NXP Semiconductors Product data sheet 20 V, 2 A PNP low VCEsat (BISS) transistor PBSS5220T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX.
NXP Semiconductors Product data sheet 20 V, 2 A PNP low VCEsat (BISS) transistor PBSS5220T CHARACTERISTICS Tamb = 25 °C unless otherwise specified SYMBOL ICBO PARAMETER CONDITIONS collector-base cut-off current VCB = −20 V; IE = 0 MIN. TYP. MAX.
NXP Semiconductors Product data sheet 20 V, 2 A PNP low VCEsat (BISS) transistor PBSS5220T PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.
NXP Semiconductors Product data sheet 20 V, 2 A PNP low VCEsat (BISS) transistor PBSS5220T DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved.
