Datasheet

PCF8563 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 10 — 3 April 2012 37 of 50
NXP Semiconductors
PCF8563
Real-time clock/calendar
15. Package outline
Fig 30. Package outline SOT650-1 (HVSON10) of PCF8563BS
0.50.21
0.05
0.00
A
1
E
h
b
UNIT
D
(1)
ye
2
e
1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
3.1
2.9
cD
h
1.75
1.45
y
1
3.1
2.9
2.55
2.15
0.30
0.18
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT650-1 MO-229 - - -- - -
E
(1)
0.55
0.30
L
0.1
v
0.05
w
0 2 mm1
scale
SOT650-1
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
D
h
E
h
e
L
10
51
6
D
E
y
1
C
C
B
A
01-01-22
02-02-08
terminal 1
index area
terminal 1
index area
X
e
1
b
AC
C
B
v
M
w
M
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.