PCF8883 Capacitive touch/proximity switch with auto-calibration, large voltage operating range, and very low power consumption Rev. 4 — 17 March 2014 Product data sheet 1. General description The integrated circuit PCF8883 is a capacitive touch and proximity switch that uses a patented (EDISEN) digital method to detect a change in capacitance on a remote sensing plate.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration Buildings: switch in or under carpets, glass, or tiles Sanitary applications: use of standard metal sanitary parts (e.g. tap) as switch Hermetically sealed keys on a keyboard 4. Ordering information Table 1. Ordering information Type number Package Name Description Version PCF8883T SOIC8 plastic small outline package; 8 leads; body width 3.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 6. Block diagram 9'' ,175(*' 92/7$*( 5(*8/$725 9'' &2817(5 /2*,& 287 6(1625 /2*,& 966 3&) ,1 26&,//$725 IV 7<3( &3& &/,1 DDD Fig 1. PCF8883 Product data sheet Block diagram of PCF8883 All information provided in this document is subject to legal disclaimers. Rev. 4 — 17 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 7. Pinning information 7.1 Pinning ,1 7<3( 9'' ,175(*' &/,1 3&) 7 &3& 287 966 9'' DDD Top view. For mechanical details, see Figure 17. Fig 2. Pin configuration of PCF8883T (SOIC8) 3&) 86 ,1 7<3( 9'' ,175(*' &3& &/,1 966 287 9'' DDD Viewed from active side. For mechanical details, see Figure 18. Fig 3.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 8. Functional description Figure 4 and Figure 5 show the functional principle of the PCF8883. The discharge time (tdch) of a chip-internal RC timing circuit, to which the external sensing plate is connected via pin IN, is compared to the discharge time (tdch(ref)) of a second chip-internal reference RC timing circuit.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration If the capacitance on pin IN increases, the discharge time tdch increases too. Therefore it takes longer for the voltage on the corresponding comparator to drop below Vref. Only once this happens, the comparator output becomes LOW and this results in a pulse on CDN discharging the external capacitor CCPC slightly. Thus most pulses will now be given by CUP. Without further action, capacitor CCPC would then fully charge.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration The counter, following the sensor logic depicted in Figure 4, counts the pulses of CUP or CDN respectively. The counter is reset every time the pulse sequence changes from CUP to CDN or the other way around. Pin OUT will only be activated when enough consecutive CUP or CDN pulses occur. Low-level interference or slow changes in the input capacitance do not cause the output to switch.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration &DSDFLWDQFH RQ LQSXW W 287 SXVK EXWWRQ W 287 WRJJOH W 287 SXOVH WFON + &7<3( ā PV Q) WFON + &7<3( ā PV Q) WFON + &7<3( ā PV Q) W DDD Fig 6. Switching modes timing diagram of PCF8883 8.2 Voltage regulator The PCF8883 implements a chip-internal voltage regulator supplied by pin VDD that provides an internal supply (VDD(INTREGD)) limited to a maximum of 4.6 V.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 9. Safety notes CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. CAUTION Semiconductors are light sensitive. Exposure to light sources can cause the IC to malfunction. The IC must be protected against light.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 11. Static characteristics Table 6. Static characteristics VDD = 5 V, Tamb = +25 C; unless otherwise specified. Symbol VDD VDD(INTREGD) Parameter Conditions supply voltage Unit 10 pF Ci 40 pF; 40 C Tamb +85 C 3.0 - 9.0 V 10 pF Ci 35 pF; 20 C Tamb +85 C [2] 2.8 - 9.0 V 3.0 4.0 4.6 V - 10 50 mV - 3 5 A 3.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 12. Dynamic characteristics Table 7. Dynamic characteristics VDD = 5 V, CCLIN = 22 pF, CCPC = 470 nF, Tamb = +25 C; unless otherwise specified. Symbol Parameter Conditions CCLIN capacitance on pin CLIN CCPC capacitance on pin CPC Min Typ Max Unit 0 22 100 pF 90 470 2500 nF - 14 - bit 0.1 - 470 nF VDD = 5.0 V 10 - 60 pF Tamb = 40 C to +85 C; VDD = 3.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration DDN ,'' $ 9'' 9 9'' 9 7HPSHUDWXUH & Idle state; fs = 1 kHz. Fig 9. IDD with respect to temperature DDN ,'' $ IV +] Idle state; VDD = 6 V; Tamb = 25 C. Fig 10.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 13.2 Typical reaction time DDN WVZ PV IV +] VDD = 6 V; Tamb = 25 C. Fig 11. Switching time (tsw) with respect to sampling frequency (fs) DDN WVZ PV &&/,1 S) VDD = 6 V; Tamb = 25 C. Fig 12.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration DDN WVZ PV 7HPSHUDWXUH & VDD = 6 V. Fig 13. Switching time (tsw) with respect to temperature 13.3 Reservoir capacitor voltage DDN 9, &3& 9 &,1 S) VDD = 6 V; Tamb = 25 C. VI(CPC) = input voltage on pin CPC. CIN = capacitor on pin IN. Fig 14.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration DDN 9, &3& 9 &,1 S) &,1 S) 7HPSHUDWXUH & VDD = 6 V. VI(CPC) = input voltage on pin CPC. Fig 15. Input voltage on pin CPC (VI(CPC)) with respect to temperature PCF8883 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 17 March 2014 © NXP Semiconductors N.V. 2014. All rights reserved.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 14. Application information Figure 16 shows the typical connections for a general application3. The positive supply is connected to pin VDD. It is recommended to connect smoothing capacitors to ground to both VDD and VDD(INTREGD) (values for Cdec, see Table 6).
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration Remark: CCPC should be a high-quality foil or ceramic capacitor, for example an X7R type. When limiting the maximum input capacitance to 35 pF and the minimum operating temperature to 20 C then the minimum operating voltage can be reduced to 2.8 V. The main limitation when lowering the supply voltage is a reduction in the range of the VI(CPC) voltage, which is specified from 0.6 V to VDD 0.3 V.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 15.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 16. Bare die outline :/&63 ZDIHU OHYHO FKLS VL]H SDFNDJH EXPSV 3&) 86 ' E \ [ ( $ $ $ 1RWH 0DUNLQJ FRGH 2XWOLQH YHUVLRQ )LJXUH QRW GUDZQ WR VFDOH SFI XVBGR 5HIHUHQFHV ,(& -('(& (XURSHDQ SURMHFWLRQ -(,7$ ,VVXH GDWH 3&) 86 Fig 18. Bare die outline of PCF8883US Table 8. Dimension of PCF8883US Original dimensions are in mm.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration \ 5() [ DDD Fig 19. Alignment mark of the PCF8883US die (for location and dimension see Table 10) Table 10. Alignment mark dimension and location Coordinates x y Location[1] 172 m 371 m Dimension[2] 117 m 131 m [1] The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 19) with respect to the center (x/y = 0) of the chip.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 18. Packing information 18.1 Tape and reel information 723 9,(: ' 3 : % 3 $ ' . GLUHFWLRQ RI IHHG 2ULJLQDO GLPHQVLRQV DUH LQ PP )LJXUH QRW GUDZQ WR VFDOH DDD Fig 20. Tape and reel details for PCF8883T Table 11. Carrier tape dimensions of PCF8883T Nominal values without production tolerances. Symbol Description Value Unit A0 pocket width in x direction 6.3 to 6.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 723 9,(: ' 3 : 7 % 3 $ ; . GLUHFWLRQ RI IHHG SLQ 7KH GLH KDV DFWLYH VLGH IDFLQJ GRZQ SLQ WRZDUGV WKH VSURFNHW KROHV GHWDLO ; 2ULJLQDO GLPHQVLRQV DUH LQ PP )LJXUH QRW GUDZQ WR VFDOH DDD Fig 21. Tape and reel details for PCF8883US Table 12. Carrier tape dimensions of PCF8883US Nominal values without production tolerances. Symbol Description Value Unit pocket width in x direction 0.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 19. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 19.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 19.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 22. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 20. Soldering of WLCSP packages 20.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration • The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 20.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 21. Abbreviations Table 16. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor HBM Human Body Model IC Integrated Circuit MM Machine Model MOS Metal Oxide Semiconductor MOSFET Metal–Oxide–Semiconductor Field-Effect Transistor MSL Moisture Sensitivity Level PCB Printed-Circuit Board RC Resistance-Capacitance RF Radio Frequency SMD Surface Mount Device 22.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 23. Revision history Table 17. Revision history Document ID Release date Data sheet status Change notice Supersedes PCF8883 v.4 20140317 Product data sheet - PCF8883 v.3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 24. Legal information 24.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. transportation conditions. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers.
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 26. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2 Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . .
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 27. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Fig 17. Fig 18. Fig 19. Fig 20. Fig 21. Fig 22. Fig 23. Block diagram of PCF8883 . . . . . . . . . . . . . . . . . .3 Pin configuration of PCF8883T (SOIC8) . . . . . . . .4 Pin configuration of PCF8883US (bare die). . . . . .4 Functional diagram of the sensor logic . . . . . . . . .
PCF8883 NXP Semiconductors Capacitivetouch/proximity switch with auto-calibration 28. Contents 1 2 3 4 4.1 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 13.1 13.2 13.3 14 15 16 17 18 18.1 19 19.1 19.2 19.3 19.4 20 20.1 20.2 20.3 20.3.1 20.3.2 20.3.3 20.3.4 21 22 23 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . .