LF PA K 56 PHPT60603NY 60V, 3 A NPN high power bipolar transistor 10 January 2014 Product data sheet 1. General description NPN high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package. PNP complement: PHPT60603PY 2.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 E emitter 2 E emitter 3 E emitter 4 B base mb C collector Simplified outline Graphic symbol C mb B E 1 2 3 4 sym123 LFPAK56; PowerSO8 (SOT669) 6. Ordering information Table 3.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 60 V VEBO emitter-base voltage open collector - 7 V IC collector current - 3 A ICM peak collector current - 8 A IB base current - 0.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) thermal resistance from junction to ambient Rth(j-sp) Conditions in free air Min Typ Max Unit [1] - - 115 K/W [2] - - 50 K/W [3] - - 30 K/W - - 6 K/W thermal resistance from junction to solder point [1] [2] [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor aaa-010428 102 duty cycle = 1 Zth(j-a) (K/W) 0.75 10 0.33 0.5 0.2 0.1 0.05 1 0.01 10-2 10-5 0.02 0.25 0 10-4 10-3 10-2 FR4 PCB, mounting pad for collector 6 cm Fig. 3. 10-1 1 10 102 tp (s) 103 2 Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PHPT60603NY Product data sheet All information provided in this document is subject to legal disclaimers.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 10. Characteristics Table 7.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor aaa-010143 600 aaa-010176 5 IB = 50 mA IC (A) (1) hFE 45 40 4 35 (2) 400 30 3 25 20 15 (3) 200 10 2 5 1 0 10-1 1 10 102 0 103 104 IC (mA) 1 2 3 4 VCE (V) 5 Tamb = 25 °C VCE = 1 V (1) Tamb = 100 °C Fig. 5. (2) Tamb = 25 °C Collector current as a function of collectoremitter voltage; typical values (3) Tamb = −55 °C Fig. 4.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor aaa-010145 1 aaa-010173 10 VCEsat (V) VCEsat (V) (1) 10-1 1 (2) (1) (3) (2) 10-1 (3) 10-2 10-2 10-3 10-1 Fig. 8. 1 10 102 10-3 10-1 103 104 IC (mA) 1 10 IC/IB = 20 Tamb = 25 °C (1) Tamb = 100 °C (1) IC/IB = 50 (2) Tamb = 25 °C (2) IC/IB = 20 (3) Tamb = −55 °C (3) IC/IB = 10 Collector-emitter saturation resistance as a function of collector current; typical values aaa-010175 103 Fig. 9.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 11. Test information - IB input pulse (idealized waveform) 90 % - I Bon (100 %) 10 % - I Boff output pulse (idealized waveform) - IC 90 % - I C (100 %) 10 % t td ts tr t on tf t off 006aaa266 Fig. 12. BISS transistor switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω R2 VI oscilloscope DUT R1 mgd624 Fig. 13. Test circuit for switching times 11.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 12. Package outline Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads E A2 A SOT669 C c2 b2 E1 b3 L1 mounting base b4 D1 D H L2 1 2 3 e 4 w b A X c 1/2 e A (A3) A1 C q L detail X 0 y C θ 5 mm 8° scale 0° Dimensions (mm are the original dimensions) Unit(1) A A1 A2 A3 b b2 max 1.20 0.15 1.10 0.50 4.41 nom 0.25 min 1.01 0.00 0.95 0.35 3.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 13. Soldering Footprint information for reflow soldering SOT669 4.7 4.2 0.9 (3×) 0.25 (2×) 0.25 (2×) 0.6 (4×) 3.45 0.6 (3×) 2 3.5 2.55 0.25 (2×) SR opening = Cu + 0.075 1.1 2.15 3.3 SP opening = Cu - 0.050 0.7 (4×) 1.27 3.81 solder lands solder paste 125 µm stencil solder resist occupied area Dimensions in mm sot669_fr Fig. 15.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 14. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes PHPT60603NY v.1 20131213 Product data sheet - - Modifications: • PHPT60603NY v.2 20140110 Product data sheet - PHPT60603NY v.1 PHPT60603NY Product data sheet editorial update All information provided in this document is subject to legal disclaimers. 10 January 2014 © NXP N.V. 2014.
PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 15. Legal information 15.
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PHPT60603NY NXP Semiconductors 60V, 3 A NPN high power bipolar transistor 16. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ..........................