Datasheet

MC9S08SG32 Data Sheet, Rev. 8
Freescale Semiconductor 19
Section Number Title Page
17.3 On-Chip Debug System (DBG) .................................................................................................... 279
17.3.1 Comparators A and B...................................................................................................... 279
17.3.2 Bus Capture Information and FIFO Operation............................................................... 279
17.3.3 Change-of-Flow Information.......................................................................................... 280
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 280
17.3.5 Trigger Modes................................................................................................................. 281
17.3.6 Hardware Breakpoints .................................................................................................... 283
17.4 Register Definition ........................................................................................................................ 283
17.4.1 BDC Registers and Control Bits..................................................................................... 283
17.4.2 System Background Debug Force Reset Register (SBDFR).......................................... 285
17.4.3 DBG Registers and Control Bits..................................................................................... 286
Appendix A
Electrical Characteristics
A.1 Introduction ....................................................................................................................................291
A.2 Parameter Classification.................................................................................................................291
A.3 Absolute Maximum Ratings...........................................................................................................291
A.4 Thermal Characteristics..................................................................................................................293
A.5 ESD Protection and Latch-Up Immunity.......................................................................................295
A.6 DC Characteristics..........................................................................................................................296
A.7 Supply Current Characteristics.......................................................................................................302
A.8 External Oscillator (XOSC) Characteristics ..................................................................................306
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................308
A.10 Analog Comparator (ACMP) Electricals .......................................................................................309
A.11 ADC Characteristics.......................................................................................................................310
A.12 AC Characteristics..........................................................................................................................316
A.12.1 Control Timing ................................................................................................................316
A.12.2 TPM/MTIM Module Timing...........................................................................................318
A.12.3 SPI....................................................................................................................................319
A.13 Flash Specifications........................................................................................................................323
A.14 EMC Performance..........................................................................................................................324
A.14.1 Radiated Emissions..........................................................................................................324
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information .....................................................................................................................325
B.1.1 Device Numbering Scheme .............................................................................................326
B.2 Package Information and Mechanical Drawings ...........................................................................326