Datasheet

Appendix A Electrical Characteristics
MC9S08SG32 Data Sheet, Rev. 8
Freescale Semiconductor 293
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
I/O
into account in power calculations, determine the difference between actual pin
voltage and V
SS
or V
DD
and multiply by the pin current for each I/O pin. Except in cases of unusually high
pin current (heavy loads), the difference between pin voltage and V
SS
or V
DD
will be very small.
Table A-3. Thermal Characteristics
# C Rating Symbol Value Unit
Temp
Rated
Standard
AEC Grade 0
1
—
Operating temperature range
(packaged)
Temperature Code W
T
A
–40 to 150
°C
—
♦
Temperature Code J
–40 to 140 —
♦
Temperature Code M
–40 to 125
♦
—
Temperature Code V
–40 to 105
♦
—
Temperature Code C
–40 to 85
♦
—
2
D
Thermal resistance, Single-layer board
Airflow @200
ft/min
Natural
Convection
28-pin TSSOP
θ
JA
71 91 °C/W
♦ ♦
20-pin TSSOP
94 114
♦
—
16-pin TSSOP
108 133
♦ ♦
3
D
Thermal resistance, Four-layer board
Airflow @200
ft/min
Natural
Convection
28-pin TSSOP
θ
JA
51 58 °C/W
♦ ♦
20-pin TSSOP
68 75
♦
—
16-pin TSSOP
78 92
♦ ♦
4 D Maximum junction temperature T
J
135
°C
♦
—
155 —
♦