Datasheet

Appendix A Electrical Characteristics
MC9S08SG32 Data Sheet, Rev. 8
324 Freescale Semiconductor
A.14 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.14.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East).
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
Table A-17. Radiated Emissions, Electric Field
Parameter Symbol Conditions Frequency f
OSC
/f
BUS
Level
1
(Max)
1
Data based on qualification test results.
Unit
Temp
Rated
Standard
AEC Grade 0
Radiated emissions,
electric field
V
RE_TEM
V
DD
= 5 V
T
A
= +25
o
C
package type
28 TSSOP
0.15 – 50 MHz
4 MHz crystal
20 MHz bus
12
dBμV
♦
♦
50 – 150 MHz 12
♦
♦
150 – 500 MHz 6
♦
♦
500 – 1000 MHz –8
♦
♦
IEC Level
2
2
IEC Level Maximums: N ≤ 12dBμV, L ≤ 24dBμV, I ≤ 36dBμV
N—
♦
♦
SAE Level
3
3
SAE Level Maximums: 1 ≤ 10dBμV, 2 ≤ 20dBμV, 3 ≤ 30dBμV, 4 ≤ 40dBμV
2—
♦
♦