Datasheet

Addendum for Revision 8.0
MC9S08SG32 Data Sheet Addendum, Rev. 1
Freescale Semiconductor 3
Chapter “Electrical
Characteristics”/Section
“Thermal
Characteristics”/Table A-3.
Thermal Characteristics/Page
293
Update Table A-3. Thermal Characteristics as follows:
• —Change the value for row “Thermal resistance,Single-layer board/28-pin TSSOP/Airflow
@200ft/min.” from 71 to 72 C/W
—Change the value for 16-pin TSSOP/Thermalresistance
1.Single layer board / Airflow @ 200ft/min. from 108 to 113 C/W.
2.Four layer board / Airflow @ 200ft/min. from 78 to 84 C/W.
• Update parameter 4 of Table “A-3.Thermal Characteristics” .
Chapter “Electrical
Characteristics”/Section “DC
Characteristics”/Table A-6. DC
Characteristics/Page 298
In the Table “DC Characteristics” add note 11 and 12 for parameter #18.
Note 11: Device functionality is guaranteed between the LVD threshold VLVD0 and VDD Min.
When VDD is below the minimum operating voltage (VDD Min), the analog parameters for the
IO pins, ACMP and ADC, are not guaranteed to meet data sheet performance parameters.
Note 12: In addition to LVD, it is recommended to also use the LVW feature. LVW can trigger an
interrupt and be used as an indicator to warn that the VDD is dropping,so that the software can
take actions accordingly before the VDD drops below VDD Min.
Table 1. MC9S08SG32 Rev. 1 Addendum
Location Description