Datasheet

MC9S08SG8 MCU Series Data Sheet, Rev. 8
Freescale Semiconductor 313
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08SG8 and MC9S08SG4 devices.
B.1.1 Device Numbering Scheme
Table B-1. Device Numbering System
Device
Number
1
1
See Table 1-1 for a complete description of modules included on each device.
Memory Temp Rated
2
2
Apply to the temperature rated devices marked with x only.
Available Packages
3
3
See Tabl e B - 2 for package information.
FLASH RAM Standard AEC Grade 0 20-Pin 16-Pin 8-Pin
S9S08SG8 8 K 512 x
20 TSSOP 16 TSSOP 8 NB SOIC
S9S08SG4 4 K 256 x
S9S08SG8 8 K 512 x
— 16 TSSOP —
S9S08SG4 4 K 256 x
S 9 S08 SG 8 E2 C TJ R
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
Core
SG Family
Memory Size
- 8 Kbytes
- 4 Kbytes
Mask Set Identifier
- Alpha character references 
wafer fab.
- Numeric character identifies 
mask.
Temperature Option
- C = -40 to 85 C
- V = -40 to 105 C
- M = -40 to 125 C
- W = -40 to 150 C
Package Designator
Two letter descriptor
(refer to Tabl e B-2 ).
Tape and Reel Suffix (optional)