Datasheet

Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.23
148 Freescale Semiconductor
1.9 System Clock Description
For the system clock description please refer to chapter Chapter 1, “Device Overview MC9S12G-Family”.
1.10 Modes of Operation
The MCU can operate in different modes. These are described in 1.10.1 Chip Configuration Summary.
The MCU can operate in different power modes to facilitate power saving when full system performance
is not required. These are described in 1.10.2 Low Power Operation.
Some modules feature a software programmable option to freeze the module status whilst the background
debug module is active to facilitate debugging.
1.10.1 Chip Configuration Summary
The different modes and the security state of the MCU affect the debug features (enabled or disabled).
86 PS4 MISO0 — — V
DDX
PERS/PPSS Up
87 PS5 MOSI0 — — V
DDX
PERS/PPSS Up
88 PS6 SCK0 — — V
DDX
PERS/PPSS Up
89 PS7 API_EXTCLK
SS0 — V
DDX
PERS/PPSS Up
90 VSSX2 — — — — — —
91 VDDX2 — — — — — —
92 PM0 RXCAN — — V
DDX
PERM/PPSM Disabled
93 PM1 TXCAN — — V
DDX
PERM/PPSM Disabled
94 PD4 — — — V
DDX
PUCR/PUPDE Disabled
95 PD5 — — — V
DDX
PUCR/PUPDE Disabled
96 PD6 — — — V
DDX
PUCR/PUPDE Disabled
97 PD7 — — — V
DDX
PUCR/PUPDE Disabled
98 PM2 RXD2 — — V
DDX
PERM/PPSM Disabled
99 PM3 TXD2 — — V
DDX
PERM/PPSM Disabled
100 PJ7 KWJ7
SS2 — V
DDX
PERJ/PPSJ Up
1
The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-32. KGD Option for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest---->
Power
Supply
Internal Pull
Resistor
Wire Bond
Die Pad
Pin
2nd
Func.
3rd
Func.
4th
Func.
CTRL
Reset
State