SA56004X SMBus-compatible, 8-pin, remote/local digital temperature sensor with overtemperature alarms Rev. 7 — 25 February 2013 Product data sheet 1. General description The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital temperature sensor with overtemperature alarms. The remote channel of the SA56004X monitors a diode junction, such as a substrate PNP of a microprocessor or a diode connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP).
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 3. Applications System thermal management in laptops, desktops, servers and workstations Computers and office electronic equipment Electronic test equipment and instrumentation HVAC Industrial controllers and embedded systems 4. Ordering information Table 1.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 4.1 Ordering options Table 2.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 5.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 6. Pinning information 6.1 Pinning VDD 1 8 SCLK D+ 2 7 SDATA D− 3 6 ALERT T_CRIT 4 5 GND VDD 1 8 SCLK D+ 2 7 SDATA 6 ALERT 5 GND SA56004XD D− 3 T_CRIT 4 SA56004XDP 002aad199 002aad198 Fig 2. Pin configuration for SO8 Fig 3.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 7. Functional description Refer to Figure 1 “Block diagram”. 7.1 Serial bus interface The SA56004X should be connected to a compatible two-wire serial interface System Management Bus (SMBus) as a slave device using the two device terminals SCLK and SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the ARA response.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 7.3 Register overview The SA56004X contains three types of SMBus addressable registers: read-only (R), write-only (W), and read-write (R/W). Attempting to write to any R-only register or read data from any W-only register produces an invalid result. Some of the R/W registers have separate addresses for reading and writing operations.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 5.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 C. 9. Conversion Rate register (CR) is set to 8h; the default value of about 16 conversions/s. 7.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 6. Temperature data format Temperature Digital output Binary Hexadecimal +125 C 0111 1101 0000 0000 7D00h +25 C 0001 1001 0000 0000 1900h +1 C 0000 0001 0000 0000 0100h +0.125 C 0000 0000 0010 0000 0020h 0 C 0000 0000 0000 0000 0000h 0.125 C 1111 1111 1110 0000 FFE0h 1 C 1111 1111 0000 0000 FF00h 25 C 1110 0111 0000 0000 E700h 55 C 1100 1001 0000 0000 C900h 7.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 8. CON - Configuration register (read address 03h; write address 09h) bit assignments …continued Bit Description POR state 2 Local T_CRIT mask. 0 The T_CRIT output will be activated by a local temperature that exceeds the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not be activated under this condition when this bit is HIGH. 1 Not defined; defaults to logic 0. 0 0 Fault queue.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 7.8.5 Conversion rate register (CR) The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in the standard free-running auto convert mode. Table 10 shows all applicable data values and rates for the SA56004X. Only the 4 LSBs of the register are used and the other bits are reserved for future use.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 14. TH - T_CRIT hysteresis register Single high byte (read/write address 21h)[1] Byte Bit Value [1] D7 D6 D5 D4 D3 D2 D1 D0 - - - 16 8 4 2 1 POR default TH = 0Ah (10 C). 7.8.7 Programmable offset register (remote only) Table 15.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 7.9 Interruption logic and functional description 7.9.1 ALERT output The ALERT output is used to signal Alert interruptions from the device to the SMBus or other system interrupt handler and it is active LOW. Because this is an open-drain output, a pull-up resistor (typically 10 k) to VDD is required. Several slave devices can share a common interrupt line on the same SMBus.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms remote temperature high limit remote diode temperature ALERT pin status register bit 4 (RHIGH) A B, C D E, F 002aad216 Fig 5. ALERT output in interrupt mode The following events summarize the ALERT output interrupt mode of operation: Event A: Master senses ALERT output being active-LOW. Event B: Master reads the SA56004X Status register to determine what cause the ALERT interrupt.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms the Status register, at address 02h, during the interrupt service routine and then reset the ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service routine (see Figure 6). In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT mode register must be set LOW. ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 17. ALERT response bit assignment ALERT response bit Device address bit Function 7 (MSB) ADD6 address bit 6 (MSB) of alerted device 6 ADD5 address bit 5 of alerted device 5 ADD4 address bit 4 of alerted device 4 ADD3 address bit 3 of alerted device 3 ADD2 address bit 2 of alerted device 2 ADD1 address bit 1 of alerted device 1 ADD0 address bit 0 of alerted device 0 1 always logic 1 7.9.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in the interrupt mode). 7.9.3 Fault Queue To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault Queue for both local and remote channel.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Event F: Three consecutive measurements have been made with the remote temperature below the RCS TH threshold; the T_CRIT output is de-activated (goes HIGH). Event G: The remote temp falls below the Remote LOW setpoint. Event H: Three consecutive measurements are made with the temp below the Remote LOW setpoint; ALERT output is activated (goes LOW).
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a value less than +127 C and the Alert Mask is disabled, then the ALERT output will be pulled LOW. Note that the OPEN bit itself will not trigger an ALERT.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 (cont.) SCLK a6 SDATA a5 a4 a3 a2 a1 a0 D7 S W START D6 D5 D4 D3 D2 D1 (cont.) D0 A A device address device register command 1 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 9 SCLK SDATA A P data to be written to register STOP 002aad219 a.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 7.10.1 Serial interface reset If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling the data line and transmitting on the data line, the SA56004X must be returned to a known state in the communication protocol. This may be accomplished in two ways: 1.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms • Base resistance less than 100 . • Small variation in hFE (say 50 to 150) that indicates tight control of VBE characteristics. Transistors such as 2N3904, 2N3906, or equivalents in SOT23 packages are suitable devices to use. See Table 18 for representative devices. Table 18. Representative diodes for temperature sensing Manufacturer Model number ROHM UMT3904 Diodes Inc.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 8.1.3 Layout considerations Digital boards can be electrically noisy environments, and the SA56004X is measuring very small voltages from the remote sensor, so care must be taken to minimize noise induced at the sensor inputs. The following precautions should be taken. 1. Place the SA56004X as close as possible to the remote sensing diode.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 8.2 Power sequencing considerations 8.2.1 Power supply slew rate When powering-up the SA56004X, ensure that the slew rate of VDD is less than 18 mV/s. A slew rate larger than this may cause power-on reset issues and yield unpredictable results. 8.2.2 Application circuit Figure 11 shows a typical application circuit for the SA56004X, using a discrete sensor transistor connected via a shielded, twisted-pair cable.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 9. Limiting values Table 19. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Conditions Min Max Unit supply voltage 0.3 +6 V voltage at SDATA, SCLK, ALERT, T_CRIT 0.3 +6 V VD+ voltage at positive diode input 0.3 VDD + 0.3 V VD voltage at negative diode input 0.3 +0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 10. Characteristics Table 20. Electrical characteristics VDD = 3.0 V to 3.6 V; Tamb = 40 C to +125 C; unless otherwise specified.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Table 21. SMBus interface characteristics VDD = 3.0 V to 3.6 V; Tamb = 40 C to +125 C; unless otherwise specified. These specifications are guaranteed by design and not tested in production. Symbol Parameter Conditions Min Typ Max Unit VIH HIGH-level input voltage SCLK, SDATA; VDD = 2.7 V to 5.5 V 2.2 - - V VIL LOW-level input voltage SCLK, SDATA; VDD = 2.7 V to 5.5 V - - 0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms tr tf tHD;STA tLOW SCLK tHD;DAT tHD;STA tHIGH tSU;STA tSU;STO tSU;DAT SDATA tBUF P S S P 002aad237 Fig 12. Timing measurements SA56004X Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 7 — 25 February 2013 © NXP B.V. 2013. All rights reserved.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 11. Performance curves 24 IDD shutdown (μA) 002aad228 VDD = 5.5 V 3.6 V 3.3 V 3.0 V 800 IDD quiescent (μA) 16 600 8 400 0 −50 −25 0 25 50 75 100 125 Tamb (°C) Fig 13. Typical IDD shutdown versus temperature and VDD 400 IDD quiescent (μA) 002aad230 VDD = 5.5 V 3.6 V 3.3 V 3.0 V 002aad229 VDD = 5.5 V 3.6 V 3.3 V 3.0 V 200 −50 −25 0 25 50 75 Fig 14.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 002aad232 14 VDD = 5.5 V 3.6 V 3.3 V 3.0 V IOL (mA) VDD = 5.5 V 3.6 V 3.3 V 3.0 V IOL (mA) 10 8 6 6 2 −50 −25 0 25 50 75 100 125 Tamb (°C) Fig 17. Typical T_CRIT IOL versus temperature and VDD (VOL = 0.4 V) 002aad233 2.80 Vth(UVLO) (V) 002aad234 10 4 −50 −25 0 25 50 75 100 125 Tamb (°C) Fig 18. Typical ALERT IOL versus temperature and VDD (VOL = 0.4 V) 002aad235 2.6 Vth(POR) (V) 2.78 2.2 2.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 12. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm D E SOT505-1 A X c y HE v M A Z 5 8 A2 pin 1 index (A3) A1 A θ Lp L 1 4 detail X e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K Eh 8 5 Dh 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c 0.2 D Dh E Eh e e1 K L 3.10 2.45 3.10 1.65 0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 13.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 24. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Soldering: PCB footprints 5.50 0.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 1.20 (2×) 0.60 (6×) enlarged solder land 0.3 (2×) 1.30 4.00 6.60 7.00 1.27 (6×) 5.50 board direction solder lands occupied area solder resist placement accurracy ± 0.25 Dimensions in mm sot096-1_fw Fig 26. PCB footprint for SOT96-1 (SO8); wave soldering 3.600 2.950 0.125 0.725 0.125 5.750 3.200 3.600 5.500 1.150 0.600 0.450 0.650 solder lands occupied area Dimensions in mm sot505-1_fr Fig 27.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms Footprint information for reflow soldering of HVSON8 package SOT782-1 Gx P D C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy SPx SPy Gx Gy Hy nSPx nSPy 0.65 3.25 2.2 0.525 0.3 2.45 1.65 1.1 0.65 3.25 3.25 3.5 1 1 Issue date 12-02-09 12-02-28 sot782-1_fr Fig 28.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 15. Abbreviations Table 24.
SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
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SA56004X NXP Semiconductors Digital temperature sensor with overtemperature alarms 19. Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.8.1 7.8.2 7.8.3 7.8.4 7.8.5 7.8.6 7.8.7 7.8.8 7.8.9 7.8.10 7.9 7.9.1 7.9.1.1 7.9.1.2 7.9.1.3 7.9.2 7.9.3 7.9.4 7.9.5 7.10 7.10.1 8 8.1 8.1.1 8.1.2 8.1.3 8.2 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . .