Datasheet

Product data sheet Rev. 02 — 20 June 2005 55 of 58

Philips Semiconductors

SC16C654B/654DB

5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

13. Abbreviations

Table 30: Abbreviations

Acronym Description

BRG Baud Rate Generator

CPU Central Processing Unit

DMA Direct Memory Access

FIFO First-In, First-Out

ISDN Integrated Service Digital Network

LSB Least Signiﬁcant Bit

MSB Most Signiﬁcant Bit

QUART 4-channel (Quad) Universal Asynchronous Receiver and Transmitter

UART Universal Asynchronous Receiver and Transmitter