SC18IS600 SPI to I2C-bus interface Rev. 6 — 4 May 2012 Product data sheet 1. General description The SC18IS600 is designed to serve as an interface between the standard SPI of a host (microcontroller, microprocessor, chip set, etc.) and the serial I2C-bus. This allows the host to communicate directly with other I2C-bus devices. The SC18IS600 can operate as an I2C-bus master-transmitter or master-receiver. The SC18IS600 controls all the I2C-bus specific sequences, protocol, arbitration and timing. 2.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 4. Block diagram SC18IS600 MISO MOSI SCLK CS INT CONTROL LOGIC SPI INTERRUPT CONTROL LOGIC INTERCONNECT BUS LINES AND CONTROL SIGNALS RESET BUFFER I2C-BUS CONTROLLER GENERAL PURPOSE I/Os SDA SCL GPIO0 GPIO1 GPIO2 GPIO3 IO5 IO4/WAKEUP OSCILLATOR ON-CHIP RC OSCILLATOR 002aab712 Fig 1. Block diagram of SC18IS600 SC18IS600 Product data sheet All information provided in this document is subject to legal disclaimers. Rev.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 5. Pinning information 19 n.c. 20 IO5 1 18 WAKEUP/IO4 2 17 INT VSS 3 14 INT MISO 4 13 GPIO3 MOSI 5 15 VDD 14 SCLK SDA 6 13 GPIO2 MISO 5 MOSI 6 11 SCLK SDA 7 10 GPIO2 SCL 8 12 VDD 9 GPIO1 n.c. 12 4 GPIO1 11 VSS 16 GPIO3 SC18IS600IBS n.c. 10 3 9 RESET n.c. 15 WAKEUP/IO4 8 2 7 CS n.c. 16 IO5 SCL 1 002aad707 Transparent top view 002aab713 Fig 2. 21 n.c. CS RESET GPIO0 SC18IS600IPW 22 n.c.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface Table 2. Symbol Pin description …continued Pin TSSOP16 Type Description HVQFN24 WAKEUP/IO4 15 18 I/O Wake up the SC18IS600 from the Power-down mode. Pulled LOW by the host to wake-up from low power state. This pin can also be used as a quasi-bidirectional I/O when not in a power-down state. IO5 16 20 I/O quasi-bidirectional I/O pin n.c.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface Table 4. 6.2.1.1 Pin configurations IOx.1 IOx.0 Pin configuration 0 0 quasi-bidirectional output configuration 0 1 input-only configuration 1 0 push-pull output configuration 1 1 open-drain output configuration Quasi-bidirectional output configuration Quasi-bidirectional outputs can be used both as an input and output without the need to reconfigure the pin.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface VDD 2 SYSTEM CLOCK CYCLES P strong P very weak P weak GPIOn, IOn pin pin latch data VSS input data glitch rejection 002aab882 Fig 4. 6.2.1.2 Quasi-bidirectional output configuration Open-drain output configuration The open-drain output configuration turns off all pull-ups and only drives the pull-down transistor of the pin when the pin latch contains a logic 0.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.2.1.4 Push-pull output configuration The push-pull output configuration has the same pull-down structure as both the open-drain and the quasi-bidirectional output modes, but provides a continuous strong pull-up when the pin latch contains a logic 1. The push-pull mode may be used when more source current is needed from a pin output. The push-pull pin configuration is shown in Figure 7.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.2.4 I2C-bus clock rates register (I2CClk) This register determines the I2C-bus clock frequency. Various clock rates are shown in Table 6 for the SC18IS600. The frequency can be determined using Equation 1: 6 7.3728 × 10 2 I C-bus clock frequency = ------------------------------- ( Hz ) 4 × I2CClk Table 6. (1) I2C-bus clock frequency example at 7.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.2.6 I2C-bus status register (I2CStat) This register reports the results of I2C-bus transmit and receive transaction between SC18IS600 and an I2C-bus slave device. Table 8. I2C-bus status Register value Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 I2C-bus status description 0xF0 1 1 1 1 0 0 0 0 Transmission successful. The SC18IS600 has successfully completed an I2C-bus read or write transaction.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface master slave SC18IS600 MISO MOSI SCLK SPICLK CS PORT slave OTHER SPI DEVICE SCLK CS PORT 002aab717 Fig 10. SPI single master multiple slaves configuration 6.5 SPI message format 6.5.1 Write N bytes to I2C-bus slave device SPI host sends 0x00 COMMAND NUMBER OF BYTES SLAVE ADDRESS +W DATA BYTE 1 DATA BYTE N CS SCLK MOSI command 0x00 number of bytes D[7:0] slave address A[7:1] 0 data byte 1 data byte N 002aab718 Fig 11.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.5.2 Read N bytes from I2C-bus slave device SPI host sends 0x01 COMMAND NUMBER OF BYTES SLAVE ADDRESS +R CS SCLK MOSI command 0x01 number of bytes D[7:0] slave address A[7:1] 1 002aab719 Fig 12. Read N bytes from I2C-bus slave device Once the host issues this command, the SC18IS600 will start an I2C-bus read transaction on the I2C-bus to the specified slave address.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface When the host issues a Read Buffer command, the SC18IS600 will return the data in the Read Buffer on the MISO pin. Note that the Read Buffer will be overwritten if an additional ‘Read N bytes’ or a ‘Read after write’ command is executed before the Read Buffer command. 6.5.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.5.7 Write to SC18IS600 internal registers SPI host sends 0x20 COMMAND REGISTER X DATA BYTE CS SCLK MOSI character 0x20 register X data byte 002aab723 Fig 17. Write to SC18IS600 internal registers A Write Register function is initiated by sending a 0x20 command followed by an internal register address to be written (see Section 6.1). The register data byte follows the register address.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 6.5.9 Power-down mode SPI host sends 0x30 COMMAND 0x5A 0xA5 CS SCLK MOSI character 0x30 character 0x5A character 0xA5 002aab725 Fig 19. Power-down mode The SC18IS600 can be placed in a low-power mode where the internal oscillator is stopped and it will no longer respond to SPI messages. Enter the Power-down mode by sending the power-down command (0x30) followed by the two defined bytes, which are 0x5A followed by 0xA5.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 8. Static characteristics Table 11. Static characteristics VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IDD(oper) operating supply current VDD = 3.6 V; f = 12 MHz - 7 13 mA VDD = 3.6 V; f = 18 MHz - 11 16 mA IDD(idle) Idle mode supply current VDD = 3.6 V; f = 12 MHz - 3.6 4.8 mA VDD = 3.6 V; f = 18 MHz - 4 6 mA VDD = 3.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 9. Dynamic characteristics Table 12. Dynamic characteristics VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1] Symbol fosc(RC) Parameter internal RC oscillator frequency Conditions Variable clock SC18IS600; nominal f = 7.3728 MHz; trimmed to ±1 % at Tamb = 25 °C fosc = 12 MHz Unit Min Max Min Max 7.189 7.557 7.189 7.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface Table 13. Dynamic characteristics VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1] Symbol Parameter Conditions fosc(RC) internal RC oscillator frequency SC18IS600; nominal f = 7.3728 MHz; trimmed to ±1 % at Tamb = 25 °C Variable clock fosc = 18 MHz Min Max Min Max 7.189 7.557 7.189 7.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface CS tSPIF TCLCL tSPILEAD tSPIF tSPIR tSCLKL tSPILAG tSPIR tSCLKH SCLK (input) tSPIOH tSPIDV tSPIOH tSPIDV tSPIOH tSPIDV tSPIDIS tSPIA MISO (output) slave LSB/MSB out slave MSB/LSB out not defined MOSI (input) tSPIDSU tSPIDH tSPIDSU MSB/LSB in tSPIDSU tSPIDH LSB/MSB in 002aab797 Fig 20. SPI slave timing (Mode 3) SC18IS600 Product data sheet All information provided in this document is subject to legal disclaimers. Rev.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface Table 14.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 10. Package outline TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm A B D SOT616-3 terminal 1 index area A A1 E c detail X e1 C 1/2 e e 12 y y1 C v M C A B w M C b 7 L 13 6 e e2 Eh 1/2 e 1 18 terminal 1 index area 24 19 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 11. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 11.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 11.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 27. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 12. Abbreviations Table 17.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 13. Revision history Table 18. Revision history Document ID Release date Data sheet status Change notice Supersedes SC18IS600 v.6 20120504 Product data sheet - SC18IS600_601 v.5 Modifications: • • Deleted SC18IS601 from this data sheet Section 2 “Features and benefits”, third bullet item: changed from “Master I2C-bus controller” to “Single master I2C-bus controller” SC18IS600_601 v.5 20080728 Product data sheet - SC18IS600_601 v.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use.
SC18IS600 NXP Semiconductors SPI to I2C-bus interface 16. Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.2.1.1 6.2.1.2 6.2.1.3 6.2.1.4 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 6.3 6.4 6.5 6.5.1 6.5.2 6.5.3 6.5.4 6.5.5 6.5.6 6.5.7 6.5.8 6.5.9 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 14 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . .