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ManualsBrandsNXP SEMICONDUCTORS ManualsPMICsPMIC - temperature management Internal I²C/SMBus HWSON 8 (2x3)

1. General description

The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with

JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the

C-bus/SMBus. It is typically mounted on a Dual In-Line Memory Module (DIMM)

measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile

Platform Memory Module Thermal Sensor Component specification.

The SE98A thermal sensor operates over the V

range of 1.7 V to 3.6 V. The SE98A

does not include the 2 k SPD and is designed for custom DIMM where larger SPD is

required.

The Temp Sensor (TS) consists of an Analog-to-Digital Converter (ADC) that monitors

and updates its own temperature readings 8 times per second, converts the reading to a

digital data, and latches them into the data temperature registers. User-programmable

registers, such as Shutdown or Low-power modes and the specification of temperature

event and critical output boundaries, provide flexibility for DIMM temperature-sensing

applications.

When the temperature changes beyond the specified boundary limits, the SE98A outputs

an EVENT

signal using an open-drain output that can be pulled up between 0.9 V and

3.6 V. The user has the option of setting the EVENT

output signal polarity as either an

active LOW or active HIGH comparator output for thermostat operation, or as a

temperature event interrupt output for microprocessor-based systems. The EVENT

output

can even be configured as a critical temperature output.

The SE98A supports the industry-standard 2-wire I

C-bus/SMBus serial interface. The

SMBus TIMEOUT function is supported to prevent system lock-ups. Manufacturer and

Device ID registers provide the ability to confirm the identify of the device. Three address

pins allow up to eight devices to be controlled on a single bus.

The SE98A is an improved SE98 and is comparable to the thermal sensor in the SE97 but

with voltage range of 1.7 V to 3.6 V.

2. Features

 JEDEC (JC-42.4) TS3000B1 DIMM ± 0.5 °C (typ.) between 75 °C and 95 °C

temperature sensor

 Optimized for voltage range: 1.7 V to 3.6 V

 Shutdown current: 0.1 μA (typ.) and 5.0 μA (max.)

 2-wire interface: I

C-bus/SMBus compatible, 0 Hz to 400 kHz

 SMBus ALERT and TIMEOUT (programmable)

 11-bit ADC Temperature-to-Digital converter with 0.125 °C resolution

SE98A

DDR memory module temp sensor, 1.7 V to 3.6 V

Rev. 04 — 25 November 2009 Product data sheet

Summary of content (43 pages)

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SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the I2C-bus/SMBus. It is typically mounted on a Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Thermal Sensor Component specification.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Operating current: 250 μA (typ.) and 400 μA (max.) Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C Over/under/critical temperature EVENT output B grade accuracy: ±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C ±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C ±2 °C/±3 °C (typ./max.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 5.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 6. Pinning information 6.1 Pinning terminal 1 index area 1 A1 2 A0 8 VDD A1 2 7 EVENT A2 3 6 SCL VSS 4 5 VDD 7 EVENT SDA A2 3 6 SCL VSS 4 5 SDA 002aaf008 Transparent top view 002aad757 Fig 2. 8 SE98ATP 1 SE98APW A0 Pin configuration for TSSOP8 Fig 3.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7. Functional description 7.1 Serial bus interface The SE98A uses the 2-wire serial bus (I2C-bus/SMBus) to communicate with a host controller. The serial bus consists of a clock (SCL) and data (SDA) signals. The device can operate on either the I2C-bus Standard/Fast mode or SMBus.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.3 EVENT output condition The EVENT output indicates conditions such as the temperature crossing a predefined boundary. The EVENT modes are very configurable and selected using the configuration register (CONFIG). The interrupt mode or comparator mode is selected using CONFIG[0], using either TCRIT/UPPER/LOWER or TCRIT only temperature bands (CONFIG[2]) as modified by hysteresis (CONFIG[10:9]).
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Tth(crit) − Thys temperature (°C) critical Ttrip(u) − Thys Ttrip(u) − Thys Upper Boundary Alarm Tamb Ttrip(l) − Thys Lower Boundary Alarm Ttrip(l) − Thys time EVENT in Comparator mode EVENT in Interrupt mode software interrupt clear EVENT in ‘Critical Temp only’ mode (1) (2) (1) (3) (4) (3)(5) * (6) (4) (2) 002aae324 Refer to Table 3 for figure note information. Fig 6. Table 3.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.3.2 EVENT thresholds 7.3.2.1 Alarm window The device provides a comparison window with an UPPER trip point and a LOWER trip point, programmed through the Upper Boundary Alarm Trip register (02h), and Lower Boundary Alarm Trip register (03h).
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.3.2.2 Critical trip The Tth(crit) temperature setting is programmed in the Critical Alarm Trip register (04h) as modified by hysteresis as programmed in the Configuration register. When the temperature reaches the critical temperature value in this register (and EVENT is enabled), the EVENT output asserts and cannot be de-asserted until the temperature drops below the critical temperature threshold.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V In interrupt mode, EVENT asserts when the temperature crosses the alarm upper boundary. If the EVENT output is cleared and the temperature continues to increase until it crosses the critical temperature threshold, EVENT asserts again. Because the temperature is greater than the critical temperature threshold, a Clear EVENT command does not clear the EVENT output.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.7 SMBus Time-out The SE98A supports the SMBus time-out feature. If the host holds SCL LOW between 25 ms and 35 ms, the SE98A would reset its internal state machine to the bus idle state to prevent the system bus hang-up. This feature is turned on by default. The SMBus time-out is disabled by writing a logic 1 to bit 7 of register 22h.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 7.9 SMBus/I2C-bus interface The data registers in this device are selected by the Pointer register. At power-up, the Pointer register is set to ‘00’, the location for the Capability register. The Pointer register latches the last location it was set to. Each data register falls into one of three types of user accessibility: • Read only • Write only • Write/Read same address.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 (cont.) SCL A6 SDA A5 A4 A3 A2 A1 D7 A0 S W device address and write START by host 1 2 3 4 5 6 7 D15 D14 D13 D12 D11 D10 D9 D6 D5 D4 D3 D2 D1 (cont.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 1 2 3 4 5 6 7 8 9 (cont.) SCL A6 SDA A5 A4 A3 A2 A1 (cont.) A0 R S device address and read START by host A ACK by device 1 2 3 4 5 6 7 8 D15 D14 D13 D12 D11 D10 D9 D8 9 1 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 9 SCL SDA A returned most significant byte data ACK by host NA returned least significant byte data P NACK STOP by host 002aab414 A = ACK = Acknowledge bit.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8. Register descriptions 8.1 Register overview This section describes all the registers used in the SE98A. The registers are used for latching the temperature reading, storing the low and high temperature limits, configuring, the hysteresis threshold and the ADC, as well as reporting status. The device uses the Pointer register to access these registers.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.2 Capability register (00h, 16-bit read-only) Table 6. Capability register (address 00h) bit allocation Bit 15 14 13 12 Symbol 11 10 9 8 RFU[9:2] Reset 0 0 0 0 0 0 0 0 Access R R R R R R R R Bit 7 6 5 4 3 2 1 0 WRNG HACC BCAP Symbol RFU[1:0] VHV TRES[1:0] Reset 0 0 1 1 0 1 1 1 Access R R R R R R R R Table 7.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.3 Configuration register (01h, 16-bit read/write) Table 8. Configuration register (address 01h) bit allocation Bit 15 14 13 Symbol 12 11 10 RFU 9 HEN[1:0] 8 SHMD Default 0 0 0 0 0 0 0 0 Access R R R R R R/W R/W R/W Bit 7 6 5 4 3 2 1 0 CTLB AWLB CEVNT ESTAT EOCTL CVO EP EMD Symbol Default 0 0 0 0 0 0 0 0 Access R/W R/W R/W R/W R/W R/W R/W R/W Table 9.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Table 9. Configuration register (address 01h) bit description …continued Bit Symbol Description 7 CTLB Critical Trip Lock bit. 0 — Critical Alarm Trip register is not locked and can be altered (default). 1 — Critical Alarm Trip register settings cannot be altered. This bit is initially cleared. When set, this bit will return a 1, and remains locked until cleared by internal Power-on reset.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Table 9. Configuration register (address 01h) bit description …continued Bit Symbol Description 1 EP EVENT Polarity. 0 — active LOW (default). 1 — active HIGH. When either of the Critical Trip or Alarm Window lock bits is set, this bit cannot be altered until unlocked. 0 EMD EVENT Mode.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.4 Temperature format The 16-bit value used in the following Trip Point Set and Temperature Read-Back registers is 2’s complement with the Least Significant Bit (LSB) equal to 0.0625 °C. For example: • A value of 019Ch will represent 25.75 °C • A value of 07C0h will represent 124 °C • A value of 1E64h will represent −25.75 °C. The resolution is 0.125 °C. The unused LSB (bit 0) is set to ‘0’. Bit 11 will have a resolution of 128 °C.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.5 Temperature Trip Point registers 8.5.1 Upper Boundary Alarm Trip register (16-bit read/write) The value is the upper threshold temperature value for Alarm mode. The data format is 2’s complement with bit 2 = 0.25 °C. ‘RFU’ bits will always report zero. Interrupts will respond to the presently programmed boundary values.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.5.2 Lower Boundary Alarm Trip register (16-bit read/write) The value is the lower threshold temperature value for Alarm mode. The data format is 2’s complement with bit 2 = 0.25 °C. RFU bits will always report zero. Interrupts will respond to the presently programmed boundary values.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.6 Temperature register (16-bit read-only) Table 18. Bit Symbol Temperature register bit allocation 15 14 13 12 ACT AAW BAW SIGN 11 10 9 8 TEMP[10:7] Reset 0 0 0 0 0 0 0 0 Access R R R R R R R R Bit 7 6 5 4 3 2 1 0 Symbol TEMP[6:0] RFU Reset 0 0 0 0 0 0 0 0 Access R R R R R R R R Table 19.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.7 Manufacturer’s ID register (16-bit read-only) The manufacture’s ID matches that assigned to NXP Semiconductors PCI-SIG (1131h), and is intended for use to identify the manufacturer of the device. Table 20.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 8.9 SMBus register Table 22. SMBus Time-out register bit allocation Bit 15 14 13 12 Symbol 11 10 9 8 RFU Reset 0 0 0 0 0 0 0 0 Access R R R R R R R R Bit 7 6 5 4 3 2 1 0 Symbol STMOUT Reset Access Table 23. Bit RFU SALRT 0 0 0 0 0 0 0 0 R/W R R R R R R R/W SMBus Time-out register bit description Symbol Description 15:8 RFU reserved; always 0 7 STMOUT SMBus time-out.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 9. Application design-in information In a typical application, the SE98A behaves as a slave device and interfaces to the master (or host) via the SCL and SDA lines. The host monitors the EVENT output pin, which is asserted when the temperature reading exceeds the programmed values in the alarm registers. The A0, A1 and A2 pins are directly connected to the shared SPD’s A0, A1 and A2 pins, otherwise they must be pulled HIGH or LOW.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 9.1 SE98A in memory module application Figure 15 shows the SE98A being placed in the memory module application with the SPD. The SE98A is centered in the memory module to provide the function to monitor the temperature of the DRAM. In the event of overheat, the SE98A triggers the EVENT output and the memory controller can throttle the memory bus to slow the DRAM, or the CPU can increase the refresh rate for the DRAM.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V IOL(sink)(SDA) = SDA output current LOW IOL(sink)EVENT = EVENT output current LOW 10. Limiting values Table 24. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage Vn voltage on any other pin SDA, SCL, EVENT pins −0.3 +4.2 V −0.3 +4.2 V VA0 voltage on pin A0 overvoltage input; A0 pin −0.3 +12.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Table 26. SMBus DC characteristics VDD = 1.7 V to 3.6 V; Tamb = −20 °C to +120 °C; unless otherwise specified. These specifications are guaranteed by design. Symbol Parameter Conditions Min Typ Max Unit VIH HIGH-level input voltage SCL, SDA; VDD = 1.7 V to 3.6 V 0.7VDD - VDD + 1 V VIL LOW-level input voltage SCL, SDA; VDD = 1.7 V to 3.6 V - - 0.3VDD V VI(ov) overvoltage input voltage pin A0; VI(ov) − VDD > 4.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 002aad881 5 Tacc (°C) Isd(VDD) (μA) 002aae376 3.0 2.0 1.0 3 VDD = 3.6 V 3.0 V 2.3 V 1.7 V 0 −1.0 1 −2.0 −1 −40 0 40 80 120 Tamb (°C) −3.0 −50 I2C-bus and temp sensor inactive. −25 0 25 50 75 100 125 Tamb (°C) VDD = 1.7 V to 3.6 V. Fig 17. Shutdown supply current Fig 18. Typical temperature accuracy 002aae377 30 IOL(sink)EVENT (mA) 002aae378 30 IOL(sink)SDA (mA) 20 VDD = 3.6 V 3.0 V 2.3 V 1.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 002aad889 3.0 Vth (V) 002aad891 120 thermal response (%) 2.5 80 (1) (2) 2.0 40 1.5 1.0 −40 0 40 80 0 120 Tamb (°C) 0 1 2 3 4 5 time (s) From 25 °C (air) to 120 °C (oil bath). For temp sensor conversion. (1) TSSOP8 (2) HWSON8 Fig 23. Average power-on threshold voltage Fig 24. Package thermal response 002aad892 5 temp error (˚C) 3 1 −1 102 103 104 105 106 107 108 noise frequency (Hz) VDD = 3.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Table 27. SMBus AC characteristics VDD = 1.7 V to 3.6 V; Tamb = −40 °C to +125 °C; unless otherwise specified. These specifications are guaranteed by design. The AC specifications fully meet or exceed SMBus 2.0 specifications, but allow the bus to interface with the I2C-bus from DC to 400 kHz.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V tLOW tr tf VIH VIL SCL tHD;STA tHD;DAT tBUF tHIGH tSU;STA tSU;STO tSU;DAT tHD;DAT VIH VIL SDA P S S P VIH VIL SCL tSU;STA tSU;STO VIH VIL SDA tW STOP condition write cycle START condition 002aae750 S = START condition P = STOP condition Fig 27. AC waveforms SE98A_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 12. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm SOT530-1 E A D X c y HE v M A Z 8 5 A2 A (A3) A1 pin 1 index θ Lp L detail X 1 4 e w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.13 3.1 2.9 4.5 4.3 0.65 6.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm SOT1069-2 X A B D A2 A E A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K E2 8 5 D2 0 1 scale Dimensions Unit mm 2 mm A(1) A1 A2 max 0.80 0.05 0.65 nom 0.75 0.02 0.55 min 0.70 0.00 0.45 A3 b D(1) D2 E(1) E2 0.2 0.30 0.25 0.18 2.1 2.0 1.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm X b v A B M B D SOT1052-1 A A E A1 detail X terminal 1 index area C 1/2 e terminal 1 index area y1 C e 1 y 4 L (8×) Eh 8 5 Dh 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm max nom min A(1) A1 b D D1 E E1 0.5 0.04 0.3 2.1 2.0 1.9 1.6 3.1 3.0 2.9 1.6 0.2 1.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 13.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 31. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations Table 30.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V Table 30. Abbreviations …continued Acronym Description RDIMM Registered Dual In-line Memory Module SO-DIMM Small Outline Dual In-line Memory Module PC Personal Computer POR Power-On Reset RWP Reversible Write Protection SMBus System Management Bus SPD Serial Presence Detect 15. Revision history Table 31.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
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SE98A NXP Semiconductors DDR memory module temp sensor, 1.7 V to 3.6 V 18. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.3.1 7.3.2 7.3.2.1 7.3.2.2 7.3.3 7.3.3.1 7.3.3.2 7.4 7.4.1 7.5 7.6 7.7 7.8 7.9 7.10 8 8.1 8.2 8.3 8.4 8.5 8.5.1 8.5.2 8.5.3 8.6 8.7 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . .