Datasheet

MPC5674F Microcontroller Data Sheet, Rev. 9
Electrical Characteristics
Freescale Semiconductor22
Table 5. Thermal Characteristics, 516-pin TEPBGA Package
1
1
Thermal characteristics are targets based on simulation that are subject to change per device
characterization. This data is PRELIMINARY based on similar package used on other devices.
Characteristic Symbol Value Unit
Junction to Ambient
2,3
Natural Convection (Single layer board)
2
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
3
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
R
JA
25 °C/W
Junction to Ambient
2,4
Natural Convection (Four layer board 2s2p)
4
Per JEDEC JESD51-6 with the board horizontal.
R
JA
18 °C/W
Junction to Ambient (@200 ft./min., Single layer board) R
JMA
20 °C/W
Junction to Ambient (@200 ft./min., Four layer board 2s2p) R
JMA
15 °C/W
Junction to Board
5
5
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
R
JB
10 °C/W
Junction to Case
6
6
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
R
JC
6°C/W
Junction to Package Top
7
Natural Convection
7
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.

JT
2°C/W
Table 6. Thermal Characteristics, 324-pin Package
1
1
Thermal characteristics are targets based on simulation that are subject to change per device
characterization. This data is PRELIMINARY based on similar package used on other devices.
MPC5674F Thermal Characteristic Symbol Value Unit
Junction to ambient
2, 3
, natural convection (one-layer board)
2
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
3
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
R
JA
29 °C/W
Junction to ambient
1, 4
, natural convection (four-layer board 2s2p)
4
Per JEDEC JESD51-6 with the board horizontal.
R
JA
19 °C/W
Junction to ambient (@200 ft./min., one-layer board) R
JMA
23 °C/W
Junction to ambient (@200 ft./min., four-layer board 2s2p) R
JMA
16 °C/W
Junction to board
5
(four-layer board 2s2p)
5
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
R
JB
10 °C/W
Junction to case
6
R
JC
7°C/W
Junction to package top
7
, natural convection 
JT
2°C/W