UBA20270 600 V Driver IC for dimmable compact fluorescent lamps Rev. 2 — 8 September 2011 Product data sheet 1. General description The UBA20270 is a high-voltage power IC intended to control higher powered self ballasted Compact Fluorescent Lamp (CFL) lighting applications. The UBA20270 is a controller circuit with advanced features for dimming and has a lamp current controlled boost feature for boosting cold (amalgam) CFLs.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 2.5 Protection OverCurrent Protection (OCP) in boost and burn state Capacitive Mode Protection (CMP) OverPower Protection (OPP) Power-down function OverTemperature Protection (OTP) 2.6 Other features Current controlled operating in boost and burn state External power-down function Lamp flicker suppression 3.
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UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 6. Pinning information 6.1 Pinning SLS 1 16 GHS GLS 2 15 HBO PGND 3 14 FS VDD 4 13 SGND UBA20270 RREF 5 12 CB CF 6 11 CP MDL 7 10 DCI CI 8 9 CSI 001aam664 Fig 2. Pin configuration (SO16) 6.2 Pin description Table 2.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 7. Functional description The UBA20270 is an IC for driving external half-bridge MOSFETs in self ballasted high-power CFL and their derivatives. The UBA20270 is equipped with a dimming control input that has a logarithmic corrected natural dimming function. This function enables a less sensitive brightness control of the lamp at low dim levels.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 7.1 Lamp start-up cycle 7.1.1 Reset state The UBA20270 is in a reset state while the supply voltage on the VDD pin is below the VDD(rst) level. In the reset state, a part of the internal supply is turned off, all registers, counters and timers are undefined. In addition, the hold state latch is reset and both the applied external high and low-side transistor (Q1, Q2) are non-conductive.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps The preheat time consists of eight saw-toothed pulses at the CP pin. Preheat begins as soon as the capacitor on the CP pin is charged to a voltage higher than Vth(CP)max. During the preheat time, the current feedback sensor circuit (input CSI pin) is disabled. To increase noise immunity, an internal filter of 30 ns is included at the SLS pin.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps voltage (V) 5V 2nd failed ignition attempt 1st failed ignition attempt VCP Vth(CP)max Vth(CP)min discharge to 0 V Vth(rel)CP startup time 1st preheat time tph HOLD STATE 2nd preheat time ten(ign) td(restart) tph 1st ignition enabling time restart delay time 2nd startup POWER DOWN STATE ten(ign) 2nd ignition enabling time 0V time (s) 001aan537 Fig 5. Retry cycle 7.1.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps voltage (V) 5V VCP Vth(CP)max 4.5 V 1 32 Vth(CP)min 3.8 V Vth(CB)max 3.6 V VCB Vth(CB)min 1.1 V 1 2 61 62 63 0.6 V ignition boost 0V transition burn time (s) 001aam765 Fig 6. Boost timing In the boost state, the lamp current feedback control circuit operates the same as in the burn state. This action is used to improve lamp stability. Lamp current boosted by a fixed ratio of 1.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps internal current output of the OTA is transferred via an integrator on the CI pin to the input of the Voltage Controlled Oscillator (VCO). The VCO regulates the frequency and as a result, the lamp current. BOOST AND BURN STATES Vi(DCI) > Vth(bst)DCI AND boost boost timer running (2) 00 burn select 01 boost Boost_ratio = 1 Boost_ratio = 1.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps When CP is lower than Vth(rel)CP, the IC is released from the hold state and moves to the start-up state. See Figure 3. Alternatively, the hold state ends when the supply voltage is lower than VDD(rst) and the IC is reset. With a 470 nF capacitor on the CP pin, the typical hold state retention delay is between 1.0 seconds and 1.7 seconds.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps voltage (V) VCF 0 tdch V(GHS-HBO) 0 VGLS tno tno 0 VHBO 0 time (s) 001aam766 Fig 8. Sawtooth, gate driver and half-bridge output signals 7.2.2 Combined timing circuit A combined timing circuit is included to determine the preheat time, ignition enabling time and overcurrent time, see Figure 9. The circuit consists of a clock generator defined by CCP and Rext(RREF) and a counter.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps voltage (V) ignition enabling time 5V VCP Vth(CP)max 4.5 V Vth(CP)min 3.8 V CFL ignition overcurrent ignition time startup time preheat time 0V fault time boost-burn power down time (s) 001aam768 Fig 9. Timing diagram preheat, ignition and overcurrent 7.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps voltage (V) 1.2 Vi(CSI) [VRMS] internal clamp (1) Vclamp(CSI) 1.0 100 % 0.8 0.6 VLD 0.4 midcurve 0.2 Vth(hys)DCI MDL 0 0 0.4 0.2 VT(hec1)DCI 0.6 0.8 VT(hec2)DCI 1.0 0.9 Vth(start)DCI 1.2 1.4 1.6 Vi(DCI) (V) voltage (V) VT(hec3)DCI 001aam671 (1) Vi(CSI) = VLD = f(Vi(DCI)) Fig 10. CSI voltage as a function of DCI voltage 7.4 Protection and power-down 7.4.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Coil saturation protection is triggered when the voltage on the SLS pin exceeds Vth(sat)SLS. The voltage VSLS on the SLS pin is also used to set the preheat current. The value of external resistor RSLS determines this voltage. 7.4.2 OverCurrent Protection (OCP) OCP is active in the burn and boost states (not during boost transition).
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 7.4.5 Power-down mode Power-down mode is entered when: • a continuous overcurrent exceeds the maximum overcurrent time-out tfault(oc). Or over a longer period if the overcurrent occurs in more than half the number of cycles as soon as Vth(CP)min is reached.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Rext(RREF) external resistance on pin RREF fixed nominal value 33 k 30 36 k SR slew rate on pins HBO with respect to GND 4 +4 V/ns P = 0.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 10. Characteristics Table 5. Characteristics VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit high-side switch = off; low side switch = on 5.7 6.2 6.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 5. Characteristics …continued VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified. Symbol Parameter Io(CF)min Io(CF)max Conditions Min Typ Max Unit minimum output current VCF = 1.5 V; VCB = 0 V ; on pin CF VCI = Vclamp(CI) 22.8 21.8 20.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 5. Characteristics …continued VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage bootstrap diode; IFS = 5 mA; (VF = VDD - VFS) 1.3 1.7 2.1 V Vi(SLS) = 0.4 V - - 1 A 0.57 0.60 0.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 5. Characteristics …continued VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified. Symbol Parameter Vth(CB)max Conditions Min Typ Max Unit maximum threshold voltage on pin CB - 3.6 - V Vhys(CB) hysteresis voltage on pin CB 2.3 2.5 2.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 5. Characteristics …continued VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 5. Characteristics …continued VDD = 13 V; VFS - VHBO = 13 V; Tamb = 25 C; settings according to default setting in Table 6, all voltages referenced to GND, positive currents flow into the IC, unless otherwise specified. Symbol Parameter VT(hec2)DCI Conditions Min Typ Max Unit human eye correction 2 Rext(RREF) = 33 k; transition voltage on pin RMDL = 2.0 k; DCI Vi(CSI) = Vclamp(CSI) - 0.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 11. Application information 11.1 Design equations All equations are only valid for Rext(RREF) = 33 k 11.1.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 0.5 f bridge min = ---------------------------------------------------------------------------C CF + C par --------------------------- V th CF max + t dch I o CF min (8) • Minimum bridge frequency with enabled boost: 0.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Table 6. UBA20270 Product data sheet Typical components for a 230 V mains application …continued Reference Component UBA20270 R5, R6 330 k R7, R10 100 k R8 1 k R9 1 k R11 39 k RREF 33 k; 1 % RSLS 1.2 RMDL 1 k RCSI 8.2 C1, C2 22 nF; 630 V C3 3.3 nF; 1000 V Description adjust for nominal lamp current C4 10 F; 400 V C5 4.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 12. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 13. Abbreviations Table 7.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 14. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes UBA20270 v.2 20110908 Prroduct data sheet - UBA20270 v.1 UBA20270 v.1 20110816 Preliminary data sheet - - UBA20270 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 8 September 2011 © NXP B.V. 2011. All rights reserved.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements.
UBA20270 NXP Semiconductors 600 V Driver IC for dimmable compact fluorescent lamps 17. Contents 1 2 2.1 2.2 2.3 2.4 2.5 2.6 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 7.1.7 7.2 7.2.1 7.2.2 7.3 7.4 7.4.1 7.4.2 7.4.3 7.4.4 7.4.5 7.4.6 8 9 10 11 11.1 11.1.1 11.1.2 11.1.3 11.1.4 11.1.5 12 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Half-bridge features . . . . . . . . . . . . . . . . . . . . .