Datasheet

2000 Jul 31 17
NXP Semiconductors Product specification
Low power audio DAC with PLL UDA1334ATS
16 PACKAGE OUTLINE
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
1.4
1.2
0.32
0.20
0.25
0.13
5.3
5.1
4.5
4.3
0.65
6.6
6.2
0.65
0.45
0.48
0.18
10
0
o
o
0.130.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
0.75
0.45
1
SOT369-1 MO-152
99-12-27
03-02-19
w M
θ
A
A
1
A
2
b
p
D
y
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
X
(A )
3
A
0.25
18
16
9
pin 1 index
0 2.5 5 mm
scale
S
SOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
SOT369
-1
A
max.
1.5