INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines 74HC/HCT175 Quad D-type flip-flop with reset; positive-edge trigger Product specification Supersedes data of December 1990 File under Integrated Circuits, IC06 1998 Jul 08
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 The 74HC/HCT175 have four edge-triggered, D-type flip-flops with individual D inputs and both Q and Q outputs. The common clock (CP) and master reset (MR) inputs load and reset (clear) all flip-flops simultaneously. The state of each D input, one set-up time before the LOW-to-HIGH clock transition, is transferred to the corresponding output (Qn) of the flip-flop.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION 74HC175N; 74HCT175N DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 74HC175D; 74HCT175D SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 plastic shrink small outline package; 16 leads; body width 5.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger Fig.4 Functional diagram. FUNCTION TABLE INPUTS OUTPUTS OPERATING MODES MR CP Dn Qn Qn reset (clear) L X load “1” H ↑ X L H h H L load “0” H ↑ I L H Note 1.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 DC CHARACTERISTICS FOR 74HC For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard ICC category: MSI AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF Tamb (°C) TEST CONDITIONS 74HC SYMBOL PARAMETER +25 min.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 DC CHARACTERISTICS FOR 74HCT For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard ICC category: MSI Note to HCT types The value of additional quiescent supply current (∆ICC) for a unit load of 1 is given in the family specifications. To determine ∆ICC per input, multiply this value by the unit load coefficient shown in the table below.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 AC WAVEFORMS (1) Fig.6 (1) The shaded areas indicate when the input is permitted to change for predictable output performance. HC : VM = 50%; VI = GND to VCC. HCT : VM = 1.3 V; VI = GND to 3 V. (1) Waveforms showing the clock (CP) to outputs (Qn, Qn) propagation delays, the clock pulse width, output transition times and the maximum clock pulse frequency. Fig.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board.
Philips Semiconductors Product specification Quad D-type flip-flop with reset; positive-edge trigger 74HC/HCT175 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
