88W8977 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Rev. 1 — 13 July 2020 1 Product short data sheet Product overview The 88W8977 System-on-Chip (SoC) is a highly integrated single-chip solution that incorporates both Wi-Fi® (2.4/5 GHz) and Bluetooth® technology. The System-on-Chip (SoC) provides both simultaneous and independent operation of the following: • IEEE 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 88W8977 SDIO 3.0 Antenna Wi-Fi 5 GHz Tx/Rx UART Diplexer PCM interface Wi-Fi 2.4 GHz Tx/Rx and Bluetooth Tx/Rx GPIO interface Supply voltages Power-down XTAL_IN External radio coexistence XTAL_OUT Figure 1. 88W8977 functional block diagram 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 1.4 Host interfaces Wi-Fi and Bluetooth host interface options Wi-Fi Bluetooth SDIO 3.0 UART SDIO 3.0 SDIO 3.0 1.5 Operating characteristics • Supply voltage: 2.2V, 1.8V, and 1.05V • Operating temperature – Extended: -30 to 85°C – Industrial: -40 to 85°C 1.6 General features • Package options – 68-pin QFN (8 mm x 8 mm) – 74-bump eWLP (4.674 mm x 3.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 1.7 Internal block diagram Wi-Fi 5 GHz Tx/Rx Wi-Fi CPU SDIO 3.0 1x1 Wi-Fi 4 MAC/ Baseband (802.11n) 1x1 Wi-Fi 4 RF (802.11n) Wi-Fi 2.4 GHz Tx Host interface Wi-Fi 2.4 GHz Rx and Bluetooth Rx S P 3 T UART Bluetooth CPU PCM Supply voltages T/R switch Bluetooth/ Bluetooth LE Baseband Power regulator Bluetooth RF OTP D i p 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 2 Wi-Fi subsystem 2.1 IEEE 802.11 standards • 802.11b data rates of 1 and 2 Mbps • 802.11b data rates of 5.5 and 11 Mbps • 802.11a/g data rates 6, 9, 12, 18, 24, 36, 48, and 54 Mbps for multimedia content transmission • 802.11g/b performance enhancements • 802.11n with maximum data rates up to 72 Mbps (20 MHz channel), 150 Mbps (40 MHz channel) • 802.11d international roaming • 802.11e quality of service • 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 2.3 Wi-Fi baseband • • • • • • • • • • • 802.11n 1x1 SISO Backward compatibility with legacy 802.11a/g/b technology 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 2.5 Wi-Fi encryption • • • • WEP 64- and 128-bit encryption with hardware TKIP processing (WPA) AES/CCMP hardware implementation as part of the 802.11i security standard (WPA2) Enhanced AES engine performance AES/Cipher-based Message Authentication Code (CMAC) as part of the 802.11w security standard • Simultaneous Authentication of Equals (SAE) WPA3 • WLAN Authentication and Privacy Infrastructure (WAPI) 2.
8W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 3 Bluetooth subsystem 3.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 3.3 Bluetooth host interfaces • SDIO 3.0 • High-speed UART 3.4 PCM interface • • • • • 88W8977 Product short data sheet Master or slave mode PCM bit width size of 8 bits or 16 bits Up to 4 slots with configurable bit width and start positions Short frame and long frame synchronization Tri-state PCM interface capability All information provided in this document is subject to legal disclaimers. Rev.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4 Pin information 4.1 Signal diagram Note: Signals may be muxed. See Pin description (BRF_ANT signal is muxed with RF_TR_2 pin; Bluetooth external coexistence signals are muxed with both GPIO[11:8] and SD_DAT[3:0] pins).
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.2 Pin assignment - 68-pin QFN package option GPIO[5] GPIO[7] GPIO[14] GPIO[15] PDn AVDD18 UART_LTE_SOUT UART_LTE_SIN DNC DNC AVDD18 XTAL_OUT XTAL_IN AVDD18 AVDD18 AVDD18 AVSS 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 Note: Pins may have muxed signals. See Section 4.4 "Pin description".
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.3 Pad locations - 74-bump eWLP 1 A 2 3 4 5 6 7 8 A2 A3 A4 A5 A6 A7 A8 B B1 B2 B3 B4 B5 B6 B7 B8 C C1 C2 C3 C4 C5 C6 C7 C8 D D1 D2 D3 D4 D5 D6 D7 D8 E E1 E2 E3 E4 E5 E6 E7 E8 F F1 F2 F3 F4 F5 F6 F7 F8 G5 G6 G7 G8 H5 H6 H7 H8 G3 G H J1 J H2 H3 H4 J2 J3 J4 K J6 J8 K3 L1 L L2 L3 L4 L5 L6 L7 L8 Non-bump-side view Figure 5.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Pin Name Alpha-Numeric Designation Flip Chip Pad Location Relative to Die Center (non-bump-side view) X Y VIO_SD A5 200.0 2000.0 SD_DAT[0] A6 600.0 2000.0 SD_DAT[1] A7 1000.0 2000.0 VSS A8 1400.00 2000.0 GPIO[5] B1 -1400.0 1600.0 GPIO[6] B2 -1000.0 1600.0 GPIO[3] B3 -600.0 1600.0 LDO_VOUT B4 -200.0 1600.0 VCORE B5 200.0 1600.0 SD_CLK B6 600.0 1600.0 SD_DAT[2] B7 1000.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Pin Name Alpha-Numeric Designation Flip Chip Pad Location Relative to Die Center (non-bump-side view) X Y GPIO[13] E8 1400.00 400.0 AVDD18 F1 -1400.0 0.0 AVSS F2 -1000.0 0.0 AVDD18 F3 -600.0 0.0 AVSS F4 -200.0 0.0 UART_LTE_SIN F5 200.0 0.0 GPIO[11] F6 600.0 0.0 GPIO[12] F7 1000.0 0.0 VIO_RF F8 1400.00 0.0 AVSS G3 -600.0 -400.0 RF_CNTL0_N G5 200.0 -400.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Pin Name Alpha-Numeric Designation Flip Chip Pad Location Relative to Die Center (non-bump-side view) X Y AVSS L7 1000.0 -2000.0 NC L8 1400.0 -2000.0 [1] Alphanumeric designations are approximations to the grid shown in Figure 5. 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020. All rights reserved.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4 Pin description 4.4.1 Pin types Table 2. Pin types Pin type Description I/O Digital input/output I Digital input O Digital output A, I Analog input A,O Analog output NC No connect DNC Do not connect Power Power Ground Ground 4.4.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.3 General Purpose I/O (GPIO)/LED interface Table 3.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.4 RF front-end control interface Table 4.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.6 Bluetooth external coexistence interface Table 6. Bluetooth external coexistence interface Pin Name Supply No Pad Power State Reset State HW State PD State PD Prog Internal PU/ PU PD PD BT_GRANTn VIO tristate input input tristate yes nominal PU yes yes nominal PU yes yes nominal PU yes yes nominal PU yes yes Coexistence Mode: BT_GRANTn input (active low) SDIO Mode: SD_DAT[0].
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.7 SDIO host interface Table 7.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.9 LTE external coexistence interface Table 9. LTE interface Pin Name Supply No Pad Power State Reset State HW State PD State PD Prog Internal PU PU PD UART_LTE_SIN VIO tristate input input tristate yes weak PU yes yes tristate input input tristate yes weak PU yes yes UART_LTE_SIN (input) UART_LTE_SOUT VIO UART_LTE_SOUT (output) 4.4.10 PCM interface Table 10.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.12 Power supply and ground pins Table 12. Power supply and ground pins Pin Name Type Description VCORE Power 1.05V Core Power Supply VIO Power 1.8V/2.5V/3.3V Digital I/O Power Supply VIO_SD Power 1.8V/3.3V Digital I/O SDIO Power Supply VIO_RF Power 1.8V/3.3V Analog I/O RF Power Supply AVDD18 Power 1.8V Analog Power Supply VPA Power 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.4.14 Power-down pin Table 14. Power-down pin Pin Name Supply No Pad Power State Reset State HW State PD State PD Prog Internal PU/ PD PU PD PDn AVDD18 -- -- -- -- -- -- -- -- Full Power-Down (input) (active low) 0 = full power-down mode 1 = normal mode • PDn can accept an input of 1.8V to 4.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 4.5 Configuration pins Table 16 shows the pins used as configuration inputs to set the parameters following a reset. The definition of these pins changes immediately after reset to their usual function. To set a configuration bit to 0, attach a 100 kΩ resistor from the pin to ground. No external circuitry is required to set a configuration bit to 1. Table 16.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5 Power information The table in Section 4.4.12 "Power supply and ground pins " shows the required voltage levels for each rail and PDn input signal. 5.1 Leakage optimization For applications not using Wi-Fi and Bluetooth, the device can be put into a low-leakage mode of operation. Methods include: • Using the power-down (PDn) pin The power-down state provides the lowest leakage mode of operation.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5.2.1 Configuration—PMIC supplies VCORE • • • • • PMIC suppplies VCORE PMIC_EN ramps up from the host 3.3V or the host GPIO pin AVDD18 supplies PDn (follow AVDD18; PDn is connected to 1.8V supply) PMIC supplies the external VPA and AVDD18 power supply pins The host (1.8V/3.3V) supplies the external VIO/VIO_REF power supply pins PMIC VIN Host 3.3V/ Power-down from Host GPIO 88W8977 2.2V VPA 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5.2.2 Configuration—Internal LDO supplies VCORE • • • • • LDO_VOUT supplies VCORE PMIC_EN ramps up from Host 3.3V or Host GPIO pin AVDD18 supplies PDn (follow AVDD18; PDn connected to 1.8V supply) PMIC supplies the external VPA and AVDD18/LDO_VIN power supply pins The host (1.8V/3.3V) supplies the external VIO/VIO_REF power supply pins 88W8977 PMIC VIN Host 3.3V/ Power-Down from Host GPIO 2.2V VPA 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5.2.3 Power-up sequence • VPA must be good (90%) before AVDD18 starts ramping up. • AVDD18 must be good (90%) before VCORE starts ramping up. Figure 8 shows the power-up sequence. VIN/VIO EN (PMIC_EN) VPA AVDD18 PDn Power_good (90%) 2.2V Power_good (90%) 1.8V 1.8V 1.1V VCORE Internal POR XTAL_IN Strap/ Internal RESETn Boot ROM execution starts and firmware download begins Figure 8.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5.3 Power-down 5.3.1 Recommended power-down sequence In the recommended power-down sequence, VPA ramps down before AVDD18 in order for the RF PA to turn the logic off (depends on the control logic generated from AVDD18). Also, when the PMIC VBAT is removed, the PMIC cannot guarantee a ramp-down requirement. Figure 9 shows the recommended (but not required) power-down sequence. VPA (2.2V) AVDD18 (1.8V) VCORE (1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 5.3.2 Power-down using PMIC_EN host pin The maximum ramp-down time for VCORE from PMIC_EN assertion is 10 ms. PMIC_EN must be asserted a minimum of 100 ms to guarantee that VCORE and AVDD18 are discharged to less than 0.2V for the POR to generate properly after PMIC_EN is deasserted. Figure 10 shows the sequence. min 100 ms EN (PMIC_EN) VPA (2.2V) AVDD18 (1.8V)/ PDn VCORE (1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 6 Absolute maximum ratings Note: The absolute maximum ratings table defines the limitations for electrical and thermal stresses. These limits prevent permanent damage to the device. Exposure to conditions at or beyond these ratings is not guaranteed and can damage the device. Table 18.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 7 Recommended operating conditions Note: Operation beyond the recommended operating conditions is neither recommended nor guaranteed. Table 19. Recommended Operating Conditions Symbol Parameter Condition Min Typ Max Unit VCORE 1.05V core power supply -- 1.00 1.05 1.15 V -- 1.62 1.8 1.98 V -- 2.25 2.5 2.75 V -- 2.97 3.3 3.47 V -- 1.62 1.8 1.98 V -- 2.97 3.3 3.47 V -- 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8 Electrical specifications 8.1 GPIO/LED interface specifications The GPIO pins are powered by the VIO voltage supply. 8.1.1 VIO DC characteristics 8.1.1.1 1.8V operation Table 20. DC electricals—1.8V operation (VIO) Symbol Parameter Condition Min Typ Max Unit VIH Input high voltage -- 0.7*VIO -- VIO+0.4 V VIL Input low voltage -- -0.4 -- 0.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.1.2 LED Mode Table 23. LED Mode Data Over the full range of values specified in the Recommended Operating Conditions unless otherwise specified. Symbol Parameter Condition Typ Unit IOH Switching current high Tristate on pad (requires pull-up on board) Tristate when driving high mA IOL Switching current low at 0.4V 10 mA Vcc 250 Buffer 10 pF 250 Figure 11.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.2 RF front-end control interface specifications The RF front-end control pins are supplied by VIO_RF. 8.2.1 VIO_RF DC characteristics 8.2.1.1 1.8V operation Table 24. DC electricals—1.8V operation (VIO_RF) Symbol Parameter Condition Min Typ Max Unit VIH Input high voltage -- 0.7*VIO_RF -- VIO_RF+0.4 V VIL Input low voltage -- -0.4 -- 0.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.3 Wi-Fi radio specifications 8.3.1 Wi-Fi radio performance measurement The Wi-Fi transmit/receive performance is measured either at the antenna port or at the chip output port. 88W8977 Wi-Fi 5G Tx/Rx Filter Diplexer Wi-Fi 2.4G Tx/Rx Filter Antenna port Chip output port Figure 12.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.3.2 2.4 GHz Wi-Fi receiver performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, and at the chip output port. Table 26. 2.4 GHz Wi-Fi receiver performance Parameter Conditions Min Typ Max Unit RF frequency range 2.4 GHz—IEEE 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Parameter Conditions Min Typ Max Unit Receiver maximum input level 802.11 802.11b -- -1 -- dBm 802.11g -- -1 -- dBm MCS0-7 -- -1 -- dBm Receiver adjacent channel interference 1 Mbit/s rejection (ACI) 802.11b 2 Mbit/s -- 38 -- dB -- 39 -- dB 5.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.3.3 5 GHz Wi-Fi receiver performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, averaged over one channel per sub-band, averaged over the antenna path, and at the chip output port. Table 27. 5 GHz Wi-Fi receiver performance Parameter Conditions Min Typ Max Unit RF frequency range 5 GHz—IEEE 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Parameter Min Typ Max Unit 18 Mbit/s -- 26 -- dB Receiver adjacent channel interference 24 Mbit/s rejection (ACI) 802.11a 36 Mbit/s (continued) 48 Mbit/s -- 26 -- dB -- 19 -- dB -- 16 -- dB 54 Mbit/s -- 13 -- dB Receiver adjacent channel interference MCS0 rejection (ACI) 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.3.4 2.4 GHz Wi-Fi transmitter performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, and at the chip output port. Table 28. 2.4 GHz Wi-Fi transmitter performance Parameter Conditions Min Typ Max Unit RF frequency range 2.4 GHz—IEEE 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.3.5 5 GHz Wi-Fi transmitter performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, and at the chip output port. Table 29. 5 GHz Wi-Fi transmitter performance Parameter Conditions Min Typ Max Unit RF frequency range 5 GHz—IEEE 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.4 Bluetooth radio specifications The Bluetooth radio interface pin is powered by AVDD18 voltage supply. 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020. All rights reserved.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.4.1 Bluetooth/Bluetooth LE receiver performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, and at chip output port. Table 31. Bluetooth/Bluetooth LE receiver performance Parameter Conditions Min Typ Max Unit RF frequency range -- 2.4 -- 2.5 GHz IF frequency -- -- 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.4.2 Bluetooth/Bluetooth LE transmitter performance Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, and across frequency. Table 32. Bluetooth/Bluetooth LE transmitter performance Parameter Conditions Min Typ Max Unit RF frequency range -- 2.4 -- 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Parameter Conditions Min Typ Max Unit Modulation characteristics (TRM/CA/07/C) (continued) Delta F2/Delta F1 -- 0.9 -- -- Delta F2 avg -- 145 -- kHz ICFT (TRM/CA/08/C) DH1 -- 2 -- kHz Carrier frequency drift (TRM/CA/09/C) Max Drift - DH1 -- -3.5 -- kHz Drift Rate - DH1 -- 1 -- kHz Max Drift - DH3 -- -4.5 -- kHz Drift Rate - DH3 -- 1.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.5 Current consumption Note: Unless otherwise stated, all specifications are at 25°C, nominal voltage, across frequency, and at chip output port for transmit data is collected from SDIO-SDIO host interface configuration. Table 33. Current consumption Mode Sleep mode Bluetooth LE (Wi-Fi in deep sleep mode) Bluetooth (Wi-Fi in deep sleep mode) IEEE power save (Beacon interval: 100 msec) 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Mode 2.4 GHz Wi-Fi transmit 5 GHz Wi-Fi transmit Current consumption during device initialization Conditions 2.2V 1.8V 1.1V Unit 802.11b, 11 Mbit/s at 16 dBm, 1x1 225 93 83 mA 802.11g, 54 Mbit/s at 15 dBm, 1x1 185 91 95 mA 802.11n, HT20 MCS7 at 14 dBm, 1x1 164 90 97 mA 802.11a, 54 Mbit/s at 15 dBm, 1x1 186 147 98 mA 802.11n, HT20 MCS7 at 15 dBm, 1x1 185 148 105 mA 802.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.7 SDIO host interface specifications The SDIO host interface pins are powered by VIO_SD voltage supply. The SDIO electrical specifications are identical for 4-bit SDIO and 1-bit SDIO transfer modes. 8.7.1 VIO_SD DC characteristics 8.7.1.1 1.8V operation Table 34. DC electricals—1.8V operation (VIO_SD) Symbol Parameter Condition Min Typ Max Unit VIH Input high voltage -- 0.7*VIO_SD -- VIO_SD+0.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.7.2 Default speed mode and high-speed mode fPP TWL TWH Clock TISU TIH Input TODLY Output Figure 13. SDIO protocol timing diagram—Default speed mode (3.3V) fPP TWL TWH Clock TISU TIH Input TODLY TOH Output Figure 14. SDIO protocol timing diagram—High-speed mode (3.3V) 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC [1], [2] Table 36. SDIO timing data—Default speed mode and high-speed modes (3.3V) Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.7.3 SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V) TCLK fPP Clock TCR TCF TIS TIH Input TODLY TOH Output Figure 15. SDIO protocol timing diagram—SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V) Table 37. SDIO timing data——SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V) Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.7.4 DDR50 Mode (50 MHz) (1.8V) TCLK Clock TCR TCF TIS TIH CMD input TOHLD TODLY CMD output Figure 16. SDIO CMD timing diagram—DDR50 Mode (50 MHz) TCLK Clock TIS2x TIS2x TIH2x TIH2x DAT[3:0] Input TODLY2x (max) TODLY2x (max) DAT[3:0] Output TODLY2x (min) Figure 17.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Table 38. SDIO timing data—DDR50 mode (50 MHz) Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. Symbol Parameter Condition Min Typ Max Unit Clock time DDR50 20 -- -- ns DDR50 -- -- 0.2*TCLK ns DDR50 45 -- 55 % DDR50 6 -- -- ns DDR50 0.8 -- -- ns DDR50 -- -- 13.7 ns DDR50 1.5 -- -- ns DDR50 3 -- -- ns DDR50 0.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.8 UART interface specifications The UART transmit and receive pins are powered by VIO voltage supply. TBAUD UART Tx UART Rx Figure 18. Figure Caption [1] Table 39. UART timing data Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.9 PCM interface specifications The PCM pins are powered by VIO voltage supply. See Section 8.1.1 "VIO DC characteristics" for specifications. Table 40. PCM timing specification diagram for data signals—Master mode TBCLK PCM_CLK TDO PCM_DOUT TDISU TDIHO PCM_DIN Table 41. PCM timing specification diagram for sync signal—Master mode TBCLK PCM_CLK TBF TBF PCM_SYNC Table 42.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Table 43. PCM timing specification diagram for data signals—Slave mode TBCLK PCM_CLK TDO PCM_DOUT TDIHO TDISU PCM_DIN Table 44. PCM timing specification diagram for sync signal—Slave mode TBCLK PCM_CLK TBFSU TBFHO TBF PCM_SYNC Table 45. PCM timing specification data—Slave mode Symbol Parameter Condition Min Typ Max Unit FBCLK Bit clock frequency -- -- 2/2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.10 Clock specifications 8.10.1 Single-ended clock input modes 8.10.1.1 2.4 GHz mode [1] Table 46. CMOS mode Symbol Parameter Condition VIH Input high voltage -- VIL Input low voltage -- [1] Min Typ AVDD18 AVDD18 - 0.5 Max Unit 1.98 V 0 0 0.4 V Min Typ Max Unit Typical input capacitance is approximately 2 pF and input resistance is >20 kΩ. [1] Table 47.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.10.2 Crystal Table 50. Crystal specifications Parameter Condition Typical Unit Fundamental frequencies -- 26 MHz Frequency tolerance Over operating temperature < ±10 ppm Over process at 25ºC < ±10 ppm SMD and AT cut height -- <1.2 mm Load Capacitance -- 5 pF Maximum series resistance -- 45 Ω Resonance mode -- A1, Fundamental -- 8.10.3 Sleep clock Table 51.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 8.11 JTAG interface specifications The JTAG interface pins are powered by VIO voltage supply. See Section 8.1.1 "VIO DC characteristics" for specifications. TP_TCK TL_TCK TH_TCK JTAG_TCK THD_TDI TSU_TDI JTAG_TDI JTAG_TMS TDLY_TDO JTAG_TDO Figure 19. JTAG timing diagram [1] Table 52. JTAG timing data Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 9 Package information 9.1 Package thermal conditions 9.1.1 QFN package thermal conditions Table 53. Thermal conditions of QFN package Symbol Parameter Condition Typ Unit θJA Thermal resistance Junction to ambient of package. θJA = (TJ - TA)/ P P = total power dissipation JEDEC 3 in. x 4.5 in. 4-layer PCB no air flow 28.4 °C/W JEDEC 3 in. x 4.5 in. 4-layer PCB 1 meter/sec air flow 27.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 9.1.2 eWLP package thermal conditions Table 54. Thermal conditions of eWLP package Symbol Parameter Condition θJA Thermal resistance Junction to ambient of package. θJA = (TJ - TA)/ P P = total power dissipation ψJT Thermal characteristic parameter Junction to top-center of package.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 9.2 Package mechanical data 9.2.1 68-pin QFN package mechanical drawing Figure 20. 68-pin QFN package mechanical drawing 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020. All rights reserved.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 9.2.2 74-bump eWLP package mechanical drawing Figure 21. 74-bump package mechanical drawing 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020. All rights reserved.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 9.3 Package marking 9.3.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 10 Ordering information 88W8977-xx-xxxE/xx Packing code Temperature code E = Extended I = Industrial Part number Revision number Package code Figure 24. Part numbering scheme Table 55. Part Order Codes Part Order Code Package Type Packing 88W8977-A1-NMVE/AK 68-pin MQFN - 8 x 8 x 0.85 mm, with 0.4 mm pitch Tray 88W8977-A1-NMVE/AZ 68-pin MQFN - 8 x 8 x 0.85 mm, with 0.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 11 Acronyms and abbreviations Table 56.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 88W8977 Product short data sheet Acronym Definition WMM Wi-Fi Multimedia WPA Wi-Fi Protected Access WPA2 Wi-Fi Protected Access 2 WPA2-PSK Wi-Fi Protected Access 2-Pre-Shared Key WPA-PSK Wi-Fi Protect Access-Pre-Shared Key XFQFN Extra-Fine Quad Flat Non-leaded XOSC Crystal Oscillator All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 12 Revision history Table 57. Revision history Revision Date Description Rev. 1 13-Jul-2020 Initial release 88W8977 Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 13 July 2020 © NXP B.V. 2020. All rights reserved.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC 13 Legal information 13.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Tables Tab. 1. Tab. 2. Tab. 3. Tab. 4. Tab. 5. Tab. 6. Tab. 7. Tab. 8. Tab. 9. Tab. 10. Tab. 11. Tab. 12. Tab. 13. Tab. 14. Tab. 15. Tab. 16. Tab. 17. Tab. 18. Tab. 19. Tab. 20. Tab. 21. Tab. 22. Tab. 23. Tab. 24. Tab. 25. Tab. 26. Tab. 27. Tab. 28. Tab. 29. Tab. 30. Tab. 31. Tab. 32. Pad locations—74-bump eWLP ...................... 12 Pin types .........................................................
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Contents 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 2 2.1 2.2 2.3 2.4 2.5 2.6 3 3.1 3.2 3.3 3.4 4 4.1 4.2 4.3 4.4 4.4.1 4.4.2 4.4.3 4.4.4 4.4.5 4.4.6 4.4.7 4.4.8 4.4.9 4.4.10 4.4.11 4.4.12 4.4.13 4.4.14 4.4.15 4.5 5 5.1 5.2 5.2.1 5.2.2 5.2.3 5.3 5.3.1 5.3.2 5.4 6 7 8 8.1 Product overview ................................................ 1 Applications ........................................................
88W8977 NXP Semiconductors 2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4® and Bluetooth® 5 Combo SoC Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2020. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.