Datasheet

ManualsBrandsNXP ManualsDiodesSchottky Diode, 70mA, 70V, SOT-323

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic

packages.

1.2 Features

1.3 Applications

BAS70 series;

1PS7xSB70 series

General-purpose Schottky diodes

Rev. 09 — 13 January 2010 Product data sheet

Table 1. Product overview

Type number Package Configuration

NXP JEITA

1PS76SB70 SOD323 SC-76 single diode

1PS79SB70 SOD523 SC-79 single diode

BAS70 SOT23 - single diode

BAS70H SOD123F - single diode

BAS70L SOD882 - single diode

BAS70W SOT323 SC-70 single diode

BAS70-04 SOT23 - dual series

BAS70-04W SOT323 SC-70 dual series

BAS70-05 SOT23 - dual common cathode

BAS70-05W SOT323 SC-70 dual common cathode

BAS70-06 SOT23 - dual common anode

BAS70-06W SOT323 SC-70 dual common anode

BAS70-07 SOT143B - dual isolated

BAS70-07S SOT363 SC-88 dual isolated

BAS70-07V SOT666 - dual isolated

BAS70VV SOT666 - triple isolated

BAS70XY SOT363 SC-88 quadruple; 2 series

 High switching speed  Low leakage current

 High breakdown voltage  Low capacitance

 Ultra high-speed switching  Voltage clamping

Summary of content (20 pages)

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BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 70 mA Per diode forward current IF VF forward voltage VR reverse voltage [1] [1] IF = 1 mA - - 410 mV - - 70 V Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2. Pinning information Table 3.
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NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Table 3.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes Table 3. Pinning …continued Pin Description Simplified outline Symbol BAS70XY 1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1), anode (diode 2) [1] 6 5 4 1 2 3 6 5 4 1 2 3 006aaa256 The marking bar indicates the cathode. 3. Ordering information Table 4.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 4. Marking Table 5.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 6. Thermal characteristics Table 7.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes mra803 102 IF (mA) mra805 102 IR (μA) (1) 10 10 (2) 1 1 10−1 10−1 10−2 (1) 10−2 (2) 0 (3) (3) (4) 0.2 0.4 0.6 0.8 1 10−3 0 20 40 60 80 VR (V) VF (V) (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 8. Package outline 1.35 1.15 0.45 0.15 1 2.7 2.3 0.85 0.75 1.1 0.8 1 1.65 1.25 1.55 1.15 1.8 1.6 2 2 0.40 0.25 0.25 0.10 0.34 0.26 Dimensions in mm Fig 5. 0.65 0.58 03-12-17 Package outline SOD323 (SC-76) 3.0 2.8 0.17 0.11 Dimensions in mm Fig 6. 02-12-13 Package outline SOD523 (SC-79) 1.7 1.5 1.1 0.9 1.2 1.0 1 3 0.55 0.35 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 1 2 0.48 0.38 1.9 2 0.15 0.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 3.0 2.8 2.2 1.8 1.1 0.9 1.9 6 4 2.5 2.1 1.1 0.8 5 4 2 3 0.45 0.15 3 0.45 0.15 1.4 1.2 1 2.2 1.35 2.0 1.15 pin 1 index 2 0.88 0.78 1 0.48 0.38 0.15 0.09 0.25 0.10 0.3 0.2 0.65 1.3 1.7 Dimensions in mm 04-11-16 Fig 11. Package outline SOT143B Dimensions in mm 06-03-16 Fig 12. Package outline SOT363 (SC-88) 1.7 1.5 6 0.6 0.5 5 4 0.3 0.1 1.7 1.5 1.3 1.1 pin 1 index 1 2 3 0.27 0.17 0.5 0.18 0.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) 2.15 0.50 0.60 1.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 18.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist R = 0.05 (8×) 0.30 (2×) 0.40 (2×) 0.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 0.50 (3×) 1.90 3 solder resist occupied area 1 Dimensions in mm 0.55 (3×) 2.40 msa429 Dimensions in mm Fig 21. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 3 2.10 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Dimensions in mm Fig 22.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) solder resist 4 3 2.70 occupied area 1.30 3.00 1 2 solder paste msa441 0.90 1.00 2.50 Dimensions in mm Fig 23. Reflow soldering footprint SOT143B 4.45 1.20 (3×) 4 3 1.15 4.00 4.60 solder lands 1 solder resist 2 occupied area Dimensions in mm 1.00 3.40 preferred transport direction during soldering msa422 Dimensions in mm Fig 24.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.65 0.60 (2×) 0.40 0.90 2.10 (2×) 2.35 0.50 (4×) solder paste solder lands 0.50 (4×) solder resist 1.20 2.40 occupied area MSA432 Dimensions in mm Fig 25. Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 1.3 preferred transport direction during soldering 2.45 5.3 sot363_fw Fig 26.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.538 2 1.7 1.075 0.3 (2×) 0.55 (2×) placement area solder paste occupied area 0.325 0.375 (4×) (4×) Dimensions in mm 1.7 0.45 (4×) 0.6 (2×) 0.5 (4×) 0.65 (2×) sot666_fr Reflow soldering is the only recommended soldering method. Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_9 Product data sheet © NXP B.V. 2010. All rights reserved. Rev.
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BAS70 series; 1PS7xSB70 series NXP Semiconductors General-purpose Schottky diodes 11. Revision history Table 10. Revision history Document ID Release date BAS70_1PS7XSB70_SER_9 20100113 Modifications: • Data sheet status Change notice Supersedes Product data sheet - BAS70_1PS7XSB70_SER_8 This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content.
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NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
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NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . .