Datasheet

BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 11 of 20
NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
10. Soldering
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
msa415
1.40
4.40
5.00
1.202.75
preferred transport direction during soldering
solder lands
solder resist
occupied area
mgs34
3
1.80
1.90
0.30
0.40
0.50
1.20
0.60
2.15
solder lands
solder resist
occupied area
solder paste