Datasheet

BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 09 — 13 January 2010 6 of 20
NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: t
p
≤ 300 μs; δ≤0.02.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (BAS70-07S) - - 416 K/W
SOT666 (BAS70VV)
[2]
- - 700 K/W
SOT666 (BAS70-07V)
[2]
- - 416 K/W
SOD123F
[2]
- - 330 K/W
SOD323 - - 450 K/W
SOD523
[2]
- - 450 K/W
SOD882
[2]
- - 500 K/W
SOT323 - - 625 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
SOT363 (BAS70XY)
[3]
- - 260 K/W
Table 8. Characteristics
T
amb
=25 ° C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
F
forward voltage
[1]
I
F
=1mA - - 410 mV
I
F
=10mA - - 750 mV
I
F
=15mA - - 1 V
I
R
reverse current V
R
=50V - - 100 nA
V
R
=70V - - 10 μA
C
d
diode capacitance V
R
=0V; f=1MHz - - 2 pF