Datasheet

BAV756S_BAW56_SER_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 26 November 2007 10 of 15
NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
1.30
0.30R = 0.05 (12×) R = 0.05 (12×)
0.60 0.70 0.80
0.90
0.30
(2×)
0.35
(2×)
0.20
0.40
(2×)
0.50
(2×)
0.25
(2×)
0.30
0.40
0.50