Datasheet

BAV756S_BAW56_SER_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 26 November 2007 11 of 15
NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
sot363
1.20
2.40
0.50
(4×)
0.40
(2×)
0.90 2.10
0.50
(4×)
0.60
(2×)
2.35
2.65
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
solder lands
solder resist
occupied area
1.15
3.75
transport direction during soldering
1.000.30 4.00
4.50
5.25
sot363
Dimensions in mm