Datasheet

BAV756S_BAW56_SER_5 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 05 — 26 November 2007 9 of 15
NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BAV756S SOT363 4 mm pitch, 8 mm tape and reel; T1
[2]
-115 -135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125 -165
BAW56 SOT23 4 mm pitch, 8 mm tape and reel -215 -235
BAW56M SOT883 2 mm pitch, 8 mm tape and reel - -315
BAW56S SOT363 4 mm pitch, 8 mm tape and reel; T1
[2]
-115 -135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125 -165
BAW56T SOT416 4 mm pitch, 8 mm tape and reel -115 -135
BAW56W SOT323 4 mm pitch, 8 mm tape and reel -115 -135
Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85