Datasheet

BGA7130 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 9 October 2012 2 of 27
NXP Semiconductors
BGA7130
400 MHz to 2700 MHz 1 W high linearity silicon amplifier
[1] Supply voltage on pins RF_OUT and V
CC
.
[2] Current through pins RF_OUT and V
CC
.
[3] T
case
is the temperature at the soldering point of the exposed die pad.
[4] Covering downlink frequency range of eUTRAN bands 11, 13, 14 and 17.
[5] Covering downlink frequency range of eUTRAN bands 1, 4 and 10.
5. Design support
[1] See http://www.nxp.com/models.html.
T
case
case temperature
[3]
40 +25 +85 C
f frequency 400 - 2700 MHz
Measured at LTE-750 MHz (see Section 14
)
f frequency
[4]
728 748 768 MHz
G
p
power gain 728 MHz  f  768 MHz 17 20 23 dB
P
L(1dB)
output power at 1 dB gain compression 728 MHz  f  768 MHz 27 30.5 - dBm
IP3
O
output third-order intercept point 728 MHz  f  768 MHz;
P
L
= 19 dBm per tone;
tonespacing=1MHz
39 42.5 - dBm
Measured at UMTS-2140 MHz (see Section 14
)
f frequency
[5]
2110 2140 2170 MHz
G
p
power gain 2110 MHz  f  2170 MHz 9 12 15 dB
P
L(1dB)
output power at 1 dB gain compression 2110 MHz  f  2170 MHz 27 30 - dBm
IP3
O
output third-order intercept point 2110 MHz  f  2170 MHz;
P
L
= 19 dBm per tone;
tonespacing=1MHz
40.5 44 - dBm
Table 1. Quick reference data …continued
4.75 V  V
SUP
 5.25 V;  40  C  T
case
 +85  C; P
i
<  20 dBm; R3 = 523  (tolerance 1 %); input and output impedances
matched to 50  (see Section 14); pin ENABLE = HIGH; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Available design support
Download from the BGA7130 product page on http://www.nxp.com
.
Support item Available Remarks
Device models for Agilent EEsof EDA ADS planned
[1]
Based on Mextram device model.
Device models for AWR Microwave Office no
[1]
Based on Mextram device model.
Device models for ANSYS Ansoft designer no
[1]
Based on Mextram device model.
SPICE model planned
[1]
Based on Gummel-Poon device model.
S-parameters yes
Noise parameters yes
Customer evaluation kit yes See Section 6
and Section 14.
Gerber files yes Gerber files of boards provided with the customer evaluation kit.
Solder pattern yes