Datasheet

Analog Integrated Circuit Device Data
4 Freescale Semiconductor
34671
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings Symbol Value Unit
ELECTRICAL RATINGS
Input Voltage Range
VIN Pin
PPR and CHG Pins
EN, BAT, ISET, and FAST Pins
V
IN
V
PPR
, V
CHG
V
EN
, V
BAT
,
V
ISET
, V
FAST
-0.3 to 28
-0.3 to 12
-0.3 to 5.5
V
ESD Voltage
(1)
Human Body Model (HBM)
Machine Model (MM)
V
ESD
±2000
±200
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
T
A
T
J
-40 to 85
-40 to 150
°C
Storage Temperature
T
STG
-65 to 150
°C
Thermal Resistance
(2)
Junction-to-Case
Junction-to-Ambient
R
θJC
R
θJA
10
70
°C/W
Peak Package Reflow Temperature During Reflow
(3)
,
(4)
T
PPRT
Note 4
°C
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100pF, R
ZAP
= 1500Ω), and the Machine Model
(MM) (C
ZAP
= 200pF, R
ZAP
= 0Ω).
2. Device mounted on the Freescale EVB test board per JEDEC DESD51-2.
3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.