Datasheet

MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 15 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
10. Limiting values
[1] Stresses above one or more of the limiting values may cause permanent damage to the device.
[2] Exposure to limiting values for extended periods may affect device reliability.
[3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ.
11. Abbreviations
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max
[1][2]
Unit
I
I
input current - 30 mA
P
tot
/pack total power dissipation per package - 200 mW
T
stg
storage temperature −55 125 °C
T
amb
ambient temperature −25 70 °C
V
ESD
electrostatic discharge voltage
[3]
2- kV
I
lu
latch-up current ±100 - mA
Table 11. Abbreviations
Acronym Description
AES Advanced Encryption Standard
ATQA Answer To reQuest
ATS Answer To Select
BCC Bit Count Check
EEPROM Electrically Erasable Programmable Read-Only Memory
LCR L = inductance, Capacitance, Resistance (LCR meter)
MAC Message Authentication Code
NUID Non-Unique IDentifier
NV Non-Volatile memory
PCD Proximity Coupling Device (Contactless Reader)
PICC Proximity Integrated Circuit Card (Contactless Card)
PPS Protocol Parameter Selection
RATS Request Answer To Select
REQA REQuest Answer
SAK Select AcKnowledge, type A
SECS-II SEMI Equipment Communications Standard part 2
SEMI Semiconductors Equipment and Materials International
UID Unique IDentifier
VC Virtual Card, one MIFARE Plus PICC is one virtual card
WUPA Wake Up Protocol A