Datasheet

MF1PLUSX0Y1_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3.2 — 21 February 2011
163532 4 of 20
NXP Semiconductors
MF1PLUSx0y1
Mainstream contactless smart card IC
6. Block diagram
MF1PLUS8001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 4 kB EEPROM, 7-byte UID, no
security level 1 or 2, L3 card
SOT500-2
MF1PLUS6001DUD/13 FFC - 8 inch wafer (sawn; 120 µm thickness, on film
frame carrier; electronic fail die marking
according to SECS-II format) see Ref. 3
,
2 kB EEPROM, 7-byte UID, no security level 1 or
2, L3 card
-
MF1PLUS6001DA4/13 MOA4 PLLMC plastic leadless module carrier package; 35 mm
wide tape, 2 kB EEPROM, 7-byte UID, no
security level 1or 2, L3 card
SOT500-2
Table 2. Ordering information
…continued
Type number Package
Commercial
name
Name Description Version
Fig 1. Block diagram
001aah38
9
RF
INTERFACE
UART
ISO/IEC
14443A
AES CRYPTO
CO-PROCESSOR
CPU/LOGIC UNIT CRC
EEPROMRAMROM
TRUE RANDOM
NUMBER
GENERATOR
CRYPTO1
SECURITY
SENSORS
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR