Datasheet

NXP Semiconductors
MF0ICU2
MIFARE Ultralight C - Contactless ticket IC
MF0ICU2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 3.3 — 30 July 2019
COMPANY PUBLIC 137633 27 / 36
UNIT D
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
35.05
34.95
For unspecified dimensions see PLLMC-drawing given in the subpackage code.
DIMENSIONS (mm are the original dimensions)
SOT500-2
03-09-17
06-05-22
- - - - - -- - -
PLLMC: plastic leadless module carrier package; 35 mm wide tape
SOT500-2
A
(1)
max.
0.33
0 10 20 mm
scale
A
detail X
X
Note
1. Total package thickness, exclusive punching burr.
D
Figure 17. Package outline SOT500-2