Datasheet

NXP Semiconductors
MF0ICU2
MIFARE Ultralight C - Contactless ticket IC
MF0ICU2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 3.3 — 30 July 2019
COMPANY PUBLIC 137633 29 / 36
12.3 Bare die outline
For more details on the wafer delivery forms see Ref. 13.
43.5
MF0ICU2
LB
TEST
LA
VDD
GND
223.6
typ. 22
(1)
min. 5
x [µm] y [µm]
710
(1)
60
710
(1)
60
Chip Step
Bump size
LA, LB, VSS, VDD, TEST
typ. 22
(1)
min. 5
49.1
528.6
626
x
y
626
typ. 710
(1)
the air gap and thus the step size may vary due to varying foil expansion
all dimensions in µm, pad locations measured from metal ring edge (see detail)
(1)
(2)
aaa-013576
typ. 710
(1)
Figure 19. Bare die outline MF0ICU2x01DUy
13 Abbreviations
Table 31. Abbreviations
Acronym Description
3DES Triple Data Encryption Standard
ACK Positive Acknowledge