Datasheet

NXP Semiconductors
MF0ICU2
MIFARE Ultralight C - Contactless ticket IC
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described herein, have been included in section 'Legal information'.
© NXP B.V. 2019. All rights reserved.
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Date of release: 30 July 2019
Document identifier: MF0ICU2
Document number: 137633
Contents
1 General description ............................................ 1
1.1 Contactless energy and data transfer ................1
1.2 Anticollision ........................................................ 1
1.3 Security .............................................................. 2
1.4 Naming conventions .......................................... 2
2 Features and benefits .........................................2
2.1 MIFARE RF Interface (ISO/IEC 14443 A) ..........2
2.2 EEPROM ........................................................... 2
3 Quick reference data .......................................... 3
4 Ordering information .......................................... 3
5 Block diagram ..................................................... 4
6 Pinning information ............................................ 4
6.1 Smart card contactless module ......................... 4
7 Functional description ........................................5
7.1 Block description ............................................... 5
7.2 State diagram and logical states description ......5
7.2.1 IDLE ................................................................... 6
7.2.2 READY1 .............................................................6
7.2.3 READY2 .............................................................7
7.2.4 ACTIVE .............................................................. 7
7.2.5 HALT ..................................................................7
7.2.6 AUTHENTICATED .............................................8
7.3 Data integrity ..................................................... 8
7.4 RF interface ....................................................... 8
7.5 Memory organization ......................................... 8
7.5.1 UID/serial number ..............................................9
7.5.2 Lock byte 0 and 1 ............................................. 9
7.5.3 Lock byte 2 and 3 ........................................... 11
7.5.4 OTP bytes ........................................................12
7.5.5 3DES Authentication ........................................12
7.5.6 3DES Authentication example ......................... 13
7.5.7 Programming of 3DES key to memory ............ 14
7.5.8 Configuration for memory access via 3DES
Authentication .................................................. 15
7.5.9 Data pages ...................................................... 15
7.5.10 Initial memory configuration .............................15
7.5.11 Counter ............................................................ 16
8 Command overview .......................................... 17
8.1 MIFARE Ultralight C command overview .........17
8.2 Timings ............................................................ 18
8.3 MIFARE Ultralight C ACK and NAK .................18
8.4 Summary of device identification data ............. 19
9 MIFARE Ultralight C - Contactless ticket IC
commands ......................................................... 19
9.1 MIFARE Ultralight C - Contactless ticket IC
card activation ................................................. 19
9.2 READ ............................................................... 19
9.3 WRITE ............................................................. 20
9.4 COMPATIBILITY WRITE ................................. 21
9.5 AUTHENTICATE ............................................. 23
10 Limiting values .................................................. 24
11 Characteristics .................................................. 25
11.1 Electrical characteristics .................................. 25
12 Wafer specification ........................................... 25
12.1 Fail die identification ........................................26
12.2 Package outline ............................................... 26
12.3 Bare die outline ............................................... 29
13 Abbreviations .................................................... 29
14 References ......................................................... 30
15 Revision history ................................................ 32
16 Legal information .............................................. 33