Datasheet

ManualsBrandsNXP Manualshome security & automationMMA1211

Document Number: MMA1211KEG

Rev 0, 08/2011

Freescale Semiconductor

Data Sheet: Technical Data

Surface Mount

Micromachined Accelerometer

The MMA series of silicon capacitive, micromachined accelerometers feature

signal conditioning, a 4-pole low pass filter and temperature compensation.

Zero-g offset full scale span and filter cut-off are factory set and require no

external devices. A full system self-test capability verifies system functionality.

Features

• Integral Signal Conditioning

• Linear Output

• Ratiometric Performance

• 4th Order Bessel Filter Preserves Pulse Shape Integrity

• Calibrated Self-test

• Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status

• Transducer Hermetically Sealed at Wafer Level for Superior Reliability

• Robust Design, High Shocks Survivability

• Qualified AEC-Q100, Rev. F Grade 2 (-40°C/+105°C)

Typical Applications

• Vibration Monitoring and Recording

• Impact Monitoring

ORDERING INFORMATION

Device Name Temperature Range Case No. Package

MMA1211EG –40° to 125°C 475-01 SOIC-16

MMA1211EGR2 –40° to 125°C 475-01 SOIC16, Tape & Reel

MMA1211KEG –40° to 125°C 475-01 SOIC-16

MMA1211KEGR2 –40° to 125°C 475-01 SOIC16, Tape & Reel

”K” suffix indicates device manufactured with an alternate silicon sourcing.

MMA1211KEG

Z-AXIS SENSITIVITY

MICROMACHINED

ACCELEROMETER

±150g

KEG SUFFIX (Pb-FREE)

16-LEAD SOIC

CASE 475-01

G-Cell

Sensor

Integrator Gain Filter

Temp

Comp

Self-test

Control Logic &

EPROM Trim Circuits

Clock

Generator

Oscillator

OUT

STATUS

Figure 1. Simplified Accelerometer Functional Block Diagram

N/C

OUT

STATUS

N/C

Figure 2. Pin Connections

Summary of content (10 pages)

PAGE 1
Document Number: MMA1211KEG Rev 0, 08/2011 Freescale Semiconductor Data Sheet: Technical Data Surface Mount Micromachined Accelerometer MMA1211KEG The MMA series of silicon capacitive, micromachined accelerometers feature signal conditioning, a 4-pole low pass filter and temperature compensation. Zero-g offset full scale span and filter cut-off are factory set and require no external devices. A full system self-test capability verifies system functionality.
PAGE 2
Table 1. Maximum Ratings (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) Gpd 1500 g Unpowered Acceleration (all axes) Gupd 2000 g Supply Voltage VDD –0.3 to +7.0 V Ddrop 1.2 m Tstg –40 to +125 °C Drop Test(1) Storage Temperature Range 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge.
PAGE 3
Table 2. Operating Characteristics (Unless otherwise noted: –40°C ≤ TA ≤ +105°C, 4.75 ≤ VDD ≤ 5.25, Acceleration = 0g, Loaded output.(1)) Characteristic Symbol Min Typ Max Unit VDD IDD TA gFS 4.75 3.0 –40 — 5.00 — — 169 5.25 6.0 +125 — V mA °C g VOFF VOFF,V S SV f–3dB NLOUT 2.35 0.46 VDD 12.66 2.480 360 –2.0 2.5 0.50 VDD 13.33 2.667 400 — 2.65 0.54 VDD 14.00 2.853 440 2.0 V V mV/g mV/g/V Hz % FSO nRMS nPSD nCLK — — — — 110 2.0 2.
PAGE 4
PRINCIPLE OF OPERATION The Freescale accelerometer is a surface-micromachined integrated-circuit accelerometer. The device consists of a surface micromachined capacitive sensing cell (g-cell) and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined “cap'' wafer.
PAGE 5
BASIC CONNECTIONS 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 N/C N/C N/C N/C N/C N/C N/C N/C STATUS P1 ST P0 Accelerometer N/C N/C N/C ST VOUT STATUS VSS VDD VOUT VSS VDD A/D In R 1 kΩ C 0.01 μF C 0.1 μF Pin Name 1 thru 3 — Leave unconnected 4 ST Logic input pin used to initiate self-test 5 VOUT 6 STATUS 7 VSS The power supply ground 8 VDD The power supply input 9 thru 13 Trim pins 14 thru 16 — Logic Input 4 C 0.1 μF VDD 0.1 μF Power Supply Pin No.
PAGE 6
Dynamic Acceleration Sensing Direction +Z Acceleration of the package in the +Z direction (center plate moves in the −Z direction) will result in an increase in the output. −Z Activation of Self test moves the center plate in the −Z direction, resulting in an increase in the output. Side View Static Acceleration Sensing Direction Direction of Earth's gravity field(1) Side View 1. When positioned as shown, the Earth's gravity will result in a positive 1g output.
PAGE 7
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct 0.380 in. 9.65 mm footprint, the packages will self-align when subjected to a solder reflow process.
PAGE 8
PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 475-01 ISSUE C 16 LEAD SOIC MMA1211KEG 8 Sensors Freescale Semiconductor
PAGE 9
PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 475-01 ISSUE C 16 LEAD SOIC MMA1211KEG Sensors Freescale Semiconductor 9
PAGE 10
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.