User guide

UM10533 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
User manual Rev. 1 — 21 May 2012 19 of 23
NXP Semiconductors
UM10533
TEA1723BT GreenChip SP SMPS demo board
9.3 Core, air gap and bobbin
• Core: EE20/10/6 (3C90)
• Size of the air gap depends on the A
L
value of the ungapped core.
• Bobbin: EE20/10/6 horizontal, 14-pin
Fig 17. EE20/10/6 bobbin footprint
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